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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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JS28F128P33TF70A датащи(PDF) 8 Page - Microchip Technology |
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JS28F128P33TF70A датащи(HTML) 8 Page - Microchip Technology |
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8 / 88 page  P33-65nm Datasheet Jul 2011 8 Order Number: 208034-04 2.2 64-Ball Easy BGA Package Lead Count N - 56 - - 56 - Lead Tip Angle θ 0° 3° 5° 0° 3° 5° Seating Plane Coplanarity Y - - 0.100 - - 0.004 Lead to Package Offset Z 0.150 0.250 0.350 0.006 0.010 0.014 Notes: 1. One dimple on package denotes Pin 1. 2. If two dimples, then the larger dimple denotes Pin 1. 3. Pin 1 will always be in the upper left corner of the package, in reference to the product mark. 4. For legacy lead width, 0.10mm(Min), 0.15mm(Typ) and 0.20mm(Max). Table 1: TSOP Package Dimensions (Sheet 2 of 2) Product Information Symbol Millimeters Inches Min Nom Max Min Nom Max Figure 3: Easy BGA Mechanical Specifications (8x10x1.2 mm) E Seating Plane S1 S2 e Top View - Ball side down Bottom View - Ball Side Up Y A A1 D Ball A1 Corner A2 Note: Drawing not to scale A B C D E F G H 87 6 54 3 2 1 8 7 6 5 4 3 2 1 A B C D E F G H b Ball A1 Corner |
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