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V2DIP2-32 датащи(PDF) 2 Page - Future Technology Devices International Ltd. |
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V2DIP2-32 датащи(HTML) 2 Page - Future Technology Devices International Ltd. |
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2 / 20 page ![]() ` Copyright © 2010 Future Technology Devices International Limited 1 Document Reference No.: FT_000164 V2DIP2-32 VNCL2-32Q Development Module Datasheet Version 1.01 Clearance No.: FTDI# 151 1 Introduction V2DIP2-32 module is designed to allow rapid development of designs using the VNC2-32Q IC. The V2DIP2-32 is supplied as a PCB designed to fit into a 24 pin 0.6” wide 0.1”pitch DIP socket.The module provides access to the UART, parallel FIFO, and SPI interface pins of the VNC2-32Q device, via its IO bus pins. Two USB ports are accessed via type A USB connectors. Figure 1.1 - V2DIP2-32 The VNC2 is the second of FTDI’s Vinculum family of Embedded dual USB host controller devices. The VNC2 device provides USB Host interfacing capability for a variety of different USB device classes including support for BOMS (bulk only mass storage), Printer, HID (human interface devices). For mass storage devices such as USB Flash drives, VNC2 also transparently handles the FAT file structure. Communication with non USB devices such as a low cost microcontroller is accomplished via either UART, SPI or parallel FIFO interfaces. The VNC2 provides a new cost effective solution for providing USB Host capability into products that previously did not have the hardware resources available. The VNC2 supports the capability to enable customers to develop custom firmware using the Vinculum II development software tool suite. The development tools support compiler, linker and debugger tools complete within an integrated development environment (IDE). The Vinculum-II VNC2 family of devices are available in Pb-free (RoHS compliant) 32-lead LQFP, 32-lead QFN, 48-lead LQFP, 48-lead QFN, 64-Lead lQFP and 64-lead QFN packages |
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