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SSM2163 датащи(PDF) 5 Page - Analog Devices

номер детали SSM2163
подробное описание детали  Digitally Controlled 8 x 2 Audio Mixer
PDF  16 Pages
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производитель  AD [Analog Devices]
домашняя страница  http://www.analog.com
Logo AD - Analog Devices

SSM2163 датащи(HTML) 5 Page - Analog Devices

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SSM2163
REV. 0
–5–
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage
Dual Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±8 V
Single Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +16 V
Analog Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±V
S
Logic Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±V
S
Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 mA
Operating Temperature Range . . . . . . . . . . . . –40
°C to +85°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . +150°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . . +300
°C
THERMAL CHARACTERISTICS
Thermal Resistance
2
28-Pin Plastic DIP (SSM2163P)
θ
JA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48°C/W
θ
JC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
°C/W
28-Pin SOIC (SSM2163S)
θ
JA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68°C/W
θ
JC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
°C/W
TRANSISTOR COUNT
Number of Transistors . . . . . . . . . . . . . . . . . . 1711 MOSFETs
447 BJTs
ESD RATINGS
883 (Human Body) Model . . . . . . . . . . . . . . . . . . . . . . 1000 V
NOTES
1Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operation section of this specification is not implied. Exposure to absolute maxi-
mum rating conditions for extended periods may affect device reliability.
2
θ
JA is specified for worst-case conditions, i.e., θJA is specified for device in socket
for P-DIP and device soldered in circuit board for SOIC package.
ORDERING GUIDE
Temperature
Package
Package
Model
Range
Description
Option
SSM2163P
–40
°C to +85°C
Plastic DIP
N-28
SSM2163S
–40
°C to +85°C
SOIC
R-28
PIN CONFIGURATIONS
Epoxy Plastic DIP (P-Suffix)
and SOIC (S-Suffix)
14
13
12
11
17
16
15
20
19
18
10
9
8
1
2
3
4
7
6
5
28
27
26
25
24
23
22
21
TOP VIEW
(Not to Scale)
SSM2163
DGND
WRITE
CLK
DATA IN
SYSTEM MUTE
VSS
DATA OUT
VDD
VIN2
NC (SHIELD)
LD
VIN1
NC (SHIELD)
VIN3
NC (SHIELD)
VIN5
VCC
NC (SHIELD)
VIN4
NC (SHIELD)
VIN7
VEE
ACOM
VOUTL
VIN6
VOUTR
VIN8
AGND
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the SSM2163 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE



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