STM32F102XB datasheet(68/76 Pages) STMICROELECTRONICS

номер детали	STM32F102xB

подробное описание детали	Medium-density USB access line,ARM-based 32b MCU with 64/128KB Flash,USB FS interface,6 timers, ADC&8 com. interfaces

PDF	76 Pages

Scroll/Zoom	100%

производитель	STMICROELECTRONICS [STMicroelectronics]

домашняя страница	http://www.st.com

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68 / 76 page

Package characteristics

STM32F102x8, STM32F102xB

68/76

Doc ID 15056 Rev 4

Drawing is not to scale.

All leads/pads should also be soldered to the PCB to improve the lead solder joint life.

There is an exposed die pad on the underside of the VFQFPN package. It is recommended to connect and solder this

back-side pad to PCB ground.

Figure 34.

VFQFPN36 6 x 6 mm, 0.5 mm pitch,

package outline(1)

Figure 35.

Recommended footprint

(dimensions in mm)(1)(2)(3)

Seating plane

ddd

Pin # 1 ID

R = 0.20

ZR_ME

0.30

6.30

0.5

1.00

4.30

4.80

4.10

0.75

Table 50.

VFQFPN36 6 x 6 mm, 0.5 mm pitch, package mechanical data

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

0.800

0.900

1.000

0.0315

0.0354

0.0394

0.020

0.050

0.0008

0.0020

0.650

1.000

0.0256

0.0394

0.250

0.0098

0.180

0.230

0.300

0.0071

0.0091

0.0118

5.875

6.000

6.125

0.2313

0.2362

0.2411

1.750

3.700

4.250

0.0689

0.1457

0.1673

5.875

6.000

6.125

0.2313

0.2362

0.2411

1.750

3.700

4.250

0.0689

0.1457

0.1673

0.450

0.500

0.550

0.0177

0.0197

0.0217

0.350

0.550

0.750

0.0138

0.0217

0.0295

ddd

0.080

0.0031

Values in inches are converted from mm and rounded to 4 decimal digits.

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