DAC8426

–3–

REV. C

CAUTION

tential on any terminal.

2. The digital control inputs are zener-protected; however,

permanent damage may occur on unprotected units from

high-energy electrostatic fields. Keep units in conductive

foam at all times until ready to use.

3. Do not insert this device into powered sockets. Remove

power before insertion or removal.

4. Stresses above those listed under “Absolute Maximum Rat-

ings” may cause permanent damage to device.

Burn-In Circuit

ABSOLUTE MAXIMUM RATINGS

. . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +24 V

AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +5 V

1

1

Operating Temperature

Military AR/BR . . . . . . . . . . . . . . . . . . . . –55

°C to +125°C

Extended Industrial ER/EP/FR/FP/FS . . . . –40

°C to +85°C

Maximum Junction Temperature . . . . . . . . . . . . . . . . +150

°C

Storage Temperature . . . . . . . . . . . . . . . . . . –65

°C to +150°C

Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300

°C

THERMAL RESISTANCE

Package Type

JA

2

JC

Units

20-Pin Cerdip (R)

70

7

°C/W

20-Pin Plastic DIP (P)

61

24

°C/W

20-Pin SOL(S)

80

22

°C/W

NOTES

is not exceeded. Typical output short-circuit current to AGND is 50 mA.

2

θ

vice in socket for cerdip and P-DIP packages;

θ

dered to printed circuit board for SOL package.

20-Pin Cerdip

(R Suffix)

20-Pin Epoxy DIP

(P Suffix)

20-Pin SOL

(S Suffix)

PIN CONNECTIONS

ORDERING GUIDE

1

Model

Total Unadjusted Error

Temperature Range

Package Description

DAC8426AR

2

±1 LSB

–55

°C to +125°C

20-Pin Cerdip (Q-20)

DAC8426ER

±1 LSB

–40

°C to +85°C

20-Pin Cerdip (Q-20)

DAC8426EP

±1 LSB

–40

°C to +85°C

20-Pin Plastic DIP (N-20)

DAC8426BR

2

±2 LSB

–55

°C to +125°C

20-Pin Cerdip (Q-20)

DAC8426FR

±2 LSB

–40

°C to +85°C

20-Pin Cerdip (Q-20)

DAC8426FP

±2 LSB

–40

°C to +85°C

20-Pin Plastic DIP (N-20)

DAC8426FS

3

±2 LSB

–40

°C to +85°C

20-Lead SOL (R-20)

NOTES