REV. 0

ADG784

–4–

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the ADG784 features proprietary ESD protection circuitry, permanent damage may occur on

devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are

recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

ABSOLUTE MAXIMUM RATINGS

1

°C unless otherwise noted.)

Analog, Digital Inputs

2

30 mA, Whichever Occurs First

Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 100 mA

Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 300 mA

(Pulsed at 1 ms, 10% Duty Cycle max)

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . . –40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150

°C

Chip Scale Package

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220

°C

ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV

NOTES

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability. Only one absolute

maximum rating may be applied at any one time.

limited to the maximum ratings given.

PIN CONFIGURATION

NC = NO CONNECT

NOTE: EXPOSED PAD TIED TO SUBSTRATE, GND.

15 S4A

14 S4B

13 D4

12 S3A

S1A 1

S1B 2

D1 3

11 S3B

S2A 4

S2B 5

PIN 1

INDICATOR

TOP VIEW

ADG784

TERMINOLOGY

Most Positive Power Supply Potential.

GND

Ground (0 V) Reference.

S

Source Terminal. May be an input or output.

D

Drain Terminal. May be an input or output.

IN

Logic Control Input.

EN

Logic Control Input.

Ohmic resistance between D and S.

On Resistance match between any two channels

Flatness is defined as the difference between

the maximum and minimum value of on resis-

tance as measured over the specified analog

signal range.

Source Leakage Current with the switch “OFF.”

Drain Leakage Current with the switch “OFF.”

Channel Leakage Current with the switch “ON.”

Analog Voltage on Terminals D, S.

“OFF” Switch Source Capacitance.

“OFF” Switch Drain Capacitance.

Delay between applying the digital control input

and the output switching on. See Test Circuit 4.

Delay between applying the digital control input

and the output switching Off.

“OFF” time or “ON” time measured between

the 90% points of both switches, when switching

from one address state to another. See Test

Circuit 5.

Crosstalk

A measure of unwanted signal that is coupled

through from one channel to another as a result

of parasitic capacitance.

Off Isolation A measure of unwanted signal coupling through an

“OFF” switch.

Bandwidth

Frequency response of the switch in the ON

state measured at 3 dB down.

Distortion

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

ADG784BCP

–40

°C to +85°C

Chip Scale Package

CP-20