MSC8152 datasheet(59/68 Pages) FREESCALE

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Hardware Design Considerations

MSC8152 Dual-Core Digital Signal Processor Data Sheet, Rev. 5

Freescale Semiconductor

3.5

Connectivity Guidelines

Note:

Although the package actually uses a ball grid array, the more conventional term pin is used to denote signal

connections in this discussion.

First, select the pin multiplexing mode to allocate the required I/O signals. Then use the guidelines presented in the following

subsections for board design and connections. The following conventions are used in describing the connectivity requirements:

GND indicates using a 10 k

Ω pull-down resistor (recommended) or a direct connection to the ground plane. Direct

connections to the ground plane may yield DC current up to 50 mA through the I/O supply that adds to overall power

consumption.

VDD indicates using a 10 kΩ pull-up resistor (recommended) or a direct connection to the appropriate power supply.

Direct connections to the supply may yield DC current up to 50 mA through the I/O supply that adds to overall power

consumption.

Mandatory use of a pull-up or pull-down resistor is clearly indicated as “pull-up/pull-down.” For buses, each pin on

the bus should have its own resistor.

NC indicates “not connected” and means do not connect anything to the pin.

The phrase “in use” indicates a typical pin connection for the required function.

Note:

Please see recommendations #1 and #2 as mandatory pull-down or pull-up connection for unused pins in case of

subset interface connection.

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