AD7883 datasheet(4/12 Pages) AD

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AD7883

REV. 0

–4–

ABSOLUTE MAXIMUM RATINGS*

VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

AGND to DGND . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V

VINA, VINB to AGND (Figure 4) . . . . . –0.3 V to VDD + 0.3 V

VINA to AGND (Figure 5) . . . . . . –VDD –0.3 V to VDD + 0.3 V

VREF to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to VDD

Digital Inputs to DGND . . . . . . . . . . . –0.3 V to VDD + 0.3 V

Digital Outputs to DGND . . . . . . . . . . –0.3 V to VDD + 0.3 V

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . . –40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . –65

°C to +150°C

Lead Temperature (Soldering, 10 secs) . . . . . . . . . . . . +300

°C

Power Dissipation (Any Package) to +75

°C . . . . . . . 450 mW

Derates above +75

°C by . . . . . . . . . . . . . . . . . . . . 10 mW/°C

*Stresses above those listed under “Absolute Maximum Ratings” may cause

permanent damage to the device. This is a stress rating only and functional

operation of the device at these or any other conditions above those listed in the

operational sections of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

PIN CONFIGURATION

TOP VIEW

(Not to Scale)

AD7883

AGND

CLKIN

DGND

DB0

DB1

DB2

DB3

DB4

DB5

DB6

VDD

DB8

VINA

VINB

DB7

DB9

DB10

DB11

MODE

CONVST

BUSY

VREF

WARNING!

ESD SENSITIVE DEVICE

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AD7883 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

PIN FUNCTION DESCRIPTION

No.

Mnemonic

Function

11VINA

Analog Input.

12VINB

Analog Input.

AGND

Analog Ground.

14VREF

Voltage Reference Input. This is normally tied to VDD.

Chip Select. Active Low Logic input. The device is selected when this input is active.

CONVST

Convert Start. A low to high transition on this input puts the track/hold into hold mode and starts

conversion. This input is asynchronous to the CLKIN and is independent of CS and RD.

Read. Active Low Logic Input. This input is used in conjunction with CS low to enable data outputs.

BUSY

Active Low Logic Output. This status line indicates converter status. BUSY is low during conversion.

CLKIN

Clock Input. TTL-compatible logic input. Used as the clock source for the A/D converter. The mark/

space ratio of the clock can vary from 40/60 to 60/40.

DGND

Digital Ground.

11 . . . 22 DB0–DB11

Three-State Data Outputs. These become active when CS and RD are brought low.

MODE

MODE Input. This input is used to put the device into the power save mode (MODE = 0 V). During

normal operation, the MODE input will be a logic high (MODE = VDD).

VDD

Power Supply. This is nominally +3.3 V.

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