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RT9607 датащи(PDF) 12 Page - Richtek Technology Corporation |
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RT9607 датащи(HTML) 12 Page - Richtek Technology Corporation |
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12 / 15 page ![]() RT9607/A 12 DS9607/A-07 April 2011 www.richtek.com According to the design of RT9607/A, before driving the gate of the high side MOSFET up to 12V (or 5V), the low side MOSFET has to be off; and the high side MOSFET is turned off before the low side is turned on. From Figure 1, the body diode "D 2" had been turned on before high side MOSFETs turned on Before the low side MOSFET is turned on, the Cgd2 have been charged to Vi. Thus, as Cgd2 reverses its polarity and g2 is charged up to 12V, the required current is It is helpful to calculate these currents in a typical case. Assume a synchronous rectified BUCK converter, input voltage Vi = 12V, Vg1 = Vg2 = 12V. The high side MOSFET is PHB83N03LT whose Ciss = 1660pF, Crss = 380pF,and tr = 14nS. The low side MOSFET is PHB95N03LT whose Ciss = 2200pF, Crss = 500pF, and tr = 30nS, from the equation (1) and (2) we can obtain the total current required from the gate driving source is Ig1 = Igs + Igd1 = (1.428 + 0.326) = 1.745A (9) Ig2 = Igs2 + Igd2 = (0.88 + 0.4) = 1.28A (10) By a similar calculation, we can also get the sink current required from the turned off MOSFET. Layout Consider Figure 2. shows the schematic circuit of a two-phase synchronous-buck converter to implement the RT9607/A. The converter operates for the input rang from 5V to 12V. When layout the PC board, it should be very careful. The power-circuit section is the most critical one. If not configured properly, it will generate a large amount of EMI. The junction of Q1, Q2, L2 and Q3, Q4, L4 should be very close. The connection from Q1, and Q3 drain to positive sides of C1, C2, C3, and C4; the connection from Q2, and Q4 source to the negative sides of C1, C2, C3, and C4 should be as short as possible. Next, the trace from Ugate1, Ugate2, Lgate1, and Lgate2 should also be short to decrease the noise of the driver output signals. Phase1 and phase2 signals from the junction of the power MOSFET, carrying the large gate drive current pulses, should be as heavy as the gate drive trace. The bypass capacitor C7 should be connected to PGND directly. Furthermore, the bootstrap capacitors (Cb1, Cb2) should always be placed as close to the pins of the IC as possible. Select the Bootstrap Capacitor Figure 3. shows part of the bootstrap circuit of RT9607/A. The VCB (the voltage difference between BOOT1 and PHASE1 on RT9607/A) provides a voltage to the gate of the high side power MOSFET. This supply needs to be ensured that the MOSFET can be driven. For this, the capacitance CB has to be selected properly. It is In Figure 1, the current Ig1 and Ig2 are required to move the gate up to 12V.The operation consists of charging Cgd and Cgs. Cgs1 and Cgs2 are the capacitances from gate to source of the high side and the low side power MOSFETs, respectively. In general data sheets, the Cgs is referred as “C iss” which is the input capacitance. Cgd1 and Cgd2 are the capacitances from gate to drain of the high side and the low side power MOSFETs, respectively and referred to the data sheets as "Crss," the reverse transfer capacitance. For example, tr1 and tr2 are the rising time of the high side and the low side power MOSFETs respectively, the required current Igs1 and Igs2, are showed below r2 gs2 g2 gs2 gs2 r1 gs1 g1 gs1 gs1 t 12 x C dt dV C I t 12 x C dt dV C I = = = = (1) (2) 0.88A 12 x 10 x 2200 I 1.428A 12 x 10 x 1660 I 9 - 10 x 30 12 - gs2 9 - 10 x 14 -12 gs1 = = = = (6) (5) r2 i gd2 gd2 gd2 t 12V V C dt dV C I + = = (4) r1 gd1 g1 gd1 t 12V C dt dV C I = = (3) 0.4A 10 x 30 12) (12 x 10 x 500 I 0.326A 10 x 14 12 x 10 x 380 I 9 - 12 - gs2 9 - -12 gs1 = + = = = (8) (7) from equation. (3) and (4) |
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