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4256BWP датащи(PDF) 35 Page - STMicroelectronics

номер детали 4256BWP
подробное описание детали  256-Kbit serial I²C bus EEPROM
PDF  41 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

4256BWP датащи(HTML) 35 Page - STMicroelectronics

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M24256-BW M24256-BR M24256-BF M24256-DR M24256-DF
Package mechanical data
Doc ID 6757 Rev 28
35/41
Figure 17.
UFDFPN8 (MLP8) - 8-lead ultra thin fine pitch dual flat no lead, package
outline
1.
Drawing is not to scale.
2.
The central pad (area E2 by D2 in the above illustration) is internally pulled to VSS. It must not be
connected to any other voltage or signal line on the PCB, for example during the soldering process.
Table 20.
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
Symbol
millimeters
inches(1)
1.
Values in inches are converted from mm and rounded to four decimal digits.
Typ
Min
Max
Typ
Min
Max
A
0.550
0.450
0.600
0.0217
0.0177
0.0236
A1
0.020
0.000
0.050
0.0008
0.0000
0.0020
b
0.250
0.200
0.300
0.0098
0.0079
0.0118
D
2.000
1.900
2.100
0.0787
0.0748
0.0827
D2 (rev MC)
1.200
1.600
0.0472
0.0630
E
3.000
2.900
3.100
0.1181
0.1142
0.1220
E2 (rev MC)
1.200
1.600
0.0472
0.0630
e
0.500
0.0197
K (rev MC)
0.300
0.0118
L
0.300
0.500
0.0118
0.0197
L1
0.150
0.0059
L3
0.300
0.0118
eee(2)
2.
Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
measuring.
0.080
0.0031



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