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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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SPC560P60L3 датащи(PDF) 55 Page - STMicroelectronics |
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SPC560P60L3 датащи(HTML) 55 Page - STMicroelectronics |
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55 / 104 page  SPC56xP54x, SPC56xP60x Electrical characteristics Doc ID 18340 Rev 3 55/104 Figure 8. Independent ADC supply 3.5 Thermal characteristics 5.5V 3.0V VDD_HV_REG 3.0V 5.5V VDD_HV_AD Table 12. Thermal characteristics for 144-pin LQFP Symbol Parameter Conditions Typical value Unit RJA D Thermal resistance junction-to-ambient, natural convection(1) Single layer board—1s 53.4 °C/W D Four layer board—2s2p 43.9 °C/W RJB D Thermal resistance junction-to-board(2) Four layer board—2s2p 29.6 °C/W RJCtop D Thermal resistance junction-to-case (top)(3) Single layer board—1s 9.3 °C/W JB D Junction-to-board, natural convection(4) Operating conditions 29.8 °C/W JC D Junction-to-case, natural convection(5) Operating conditions 1.3 °C/W 1. Junction-to-ambient thermal resistance determined per JEDEC JESD51-7. Thermal test board meets JEDEC specification for this package. 2. Junction-to-board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification for the specified package. 3. Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer. 4. Thermal characterization parameter indicating the temperature difference between the board and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JB. 5. Thermal characterization parameter indicating the temperature difference between the case and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JC. |
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