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BL8596

ABSOLUTE MAXIMUM RATING

(Note1)

Parameter

Symbol

Rate

Unit

ACIN Input Voltage (ACIN to GND)

-0.3~15

V

CHRIN to GND Voltage

-0.3~6

V

GATDRV to GND Voltage

V

OUT to GND Voltage

-0.3~6

V

0.75

W

Maximum Junction Temperature

150

C

Storage Temperature

-40 to 150

Maximum Lead Soldering Temperature, 10 Seconds

260

conditions for extended periods may destroy the device.

THERMAL RESISTANCE RATING

Parameter

Device

Symbol

Typical

Unit

Junction-to-Ambient Resistance in Free Air

(Note2)

DFN2x2-8

80

C /W

SOT23-6

235

C /W

soldered directly on the PCB.

THERMAL CONSIDERATION

Even though BL8596 can handle charge current larger than 1A, it is also limited by the power dissipation of

the package DFN2x2-8L. The DFN2x2 package has a thermal pad exposed, and it should be tightly soldered

to bottom PCB with a large coil area to dissipate the heat. In general, to have the BL8596 to work under a

safe condition, one should take DFN2x2 power limit as 0.75W, and if the dropout voltage is 1.5V, one is

suggested to set the charging current to be less than 500mA.

RECOMMENDED OPERATION CONDITIONS

Symbol

Parameter

Range

Unit

ACIN Input Voltage (ACIN to GND)

4.5~10

V

Iout

Ooutput Current

0~700

mA

Ambient Temperature

-40~85

C

Junction Temperature

-40~125

C

ELECTRICAL CHARACTERISTICS

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Vth

Threshold Voltage

Ids=-1uA, Vds=Vgs

-1.0

-0.7

-0.4

V

CHRIN Voltage

5.0

5.5

6.0

V

IDss1

off-state leakage

-

-

1

uA

IDss2

reverse block leakage

2

5

uA

Idson

On –state drain current

0.9

1.2

1.5

A

Rdson

Vds/Idson

Vs=5V, Vg=1V, Vd=4V

0.5

0.75

1

ohm