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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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SC5014AEVB датащи(PDF) 16 Page - Semtech Corporation |
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SC5014AEVB датащи(HTML) 16 Page - Semtech Corporation |
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16 / 27 page  SC5014A 6 Applications Information (continued) Fault Protection The SC504A provides fault detection for low supply voltage, LED related faults, boost converter over-voltage and thermal shutdown. The open drain output pin (FLT) indicates a system fault. The nature of the fault can be read from the fault status resistor (register address: 0x00) via I2C interface. Refer to Table for a description of the Fault Protection Modes. Other Possible Configurations Depending on different application requirements, the SC504A can also be easily configured to other topolo- gies, such as the SEPIC configuration shown in Figure 4, page 2. Li-Ion Powered Display Configuration If a Li-Ion powered display application is required, V CC is needed to power with 5V. However, V IN can be set lower from 3V to 4.2V for example. An advantage of this type of configuration is that it provides higher efficiency. Please use Figure 3 on page 20 for reference. High Output Voltage Configuration If a high output voltage application is required, an addi- tional external cascode MOSFET can be added on each IO pin to meet such requirement, please refer to Figure 5 on page 2 for reference. In this case, the upper limit on the output voltage is mainly determined by the rating of the external MOSFET, heat dissipation, etc. PCB Layout Considerations The placements of the power components outside the SC504A should follow the layout guidelines of a general boost converter. The Detailed Application Circuit is used as an example. Capacitor (C2) should be placed as close as possible to the VCC and AGND to achieve the best performance. Capacitor (C) is the input power filtering capacitor for the boost. It needs to be tied to PGND. . 2. The converter power train inductor (L) is the boost converter input inductor. Use wide and short traces connecting these components. The output rectifying diode (D) uses a Schottky diode for fast reverse recovery. Transistor (Q) is the external switch. Resistor (R9) is the switch current sensing resis- tor. To minimize switching noise for the boost con- verter, the output capacitor (C6) should be placed such that the loop formed by Q, D, C6 and R9, is minimized. The output of the boost converter is used to power up the LEDs. Use wide and short trace con- necting Pin NDRV and the gate of Q. The GNDs for R9 and C6 should be PGND. These components should be close to the SC504A. Resistor (R8) is the output current adjusting resistor for IO through IO2 and should return to AGND. Place it next to the IC. Resistor (R6) is the switching frequency adjusting resistor and should return to AGND. Place it next to the IC. The decoupling capacitor (C3) for Pin REF should return to AGND. Place it next to the IC. Resistors (R4, R5) form a divider to set the SCP level, R4 should return to AGND. Place it next to the IC. Resistors (R2, R) form a divider to set the UVLO level for UVLO pin. R should return to AGND. Place it next to the IC. R and R0 form a divider to set the OVP level for VOUT, R0 should return to AGND. Place it next to the IC. All the traces for components with AGND connection should avoid being routed close to the noisy areas. An exposed pad is located at the bottom of the SC504A for heat dissipation and analog ground. A copper area underneath the pad is used for better heat dissipation. On the bottom layer of the PCB another copper area, connected through vias to the top layer, is used for better thermal performance. The pad at the bottom of the SC504A should be con- nected to AGND. AGND should be connected to PGND at a single point for better noise immunity. 3. 4. 5. 6. 7. 8. 9. 0. . 2. |
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