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SL3ICS1002 датащи(PDF) 50 Page - NXP Semiconductors |
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SL3ICS1002 датащи(HTML) 50 Page - NXP Semiconductors |
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50 / 56 page ![]() 139036 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.6 — 10 March 2011 139036 50 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 19. Revision history Table 35. Revision history Document ID Release date Data sheet status Change notice Supersedes 139036 20110310 Product data sheet 139035 Modifications: • Table 5 “TSSOP8 Marking”: added • Section 15.1.1.2 “Special behavior of user memory address 1Fh”: added 139035 20091102 Product data sheet 139034 Modifications: • Type SOT1122 added • Figure 2 “Wafer layout and pinning information”: correction of drawing 139034 20090721 Product data sheet 139033 Modifications: • Table 11 “TSSOP8 characteristics” andTable 12 “Package interface characteristics” :removed “Memory characteristics” 139033 20090605 Product data sheet - 139032 139132 Modifications: • This data sheet is a combination of data sheets SL3ICS1002 and SL3ICS1202 • New type FCS2 Aluminum, SOT1040AB2 added • Section 8.1.6 “Fail die identification”: added • Section 12 “Packing information”: edited 139032 20080716 Product data sheet 139031 Modifications: • rephrasing of Section 2 “Features and benefits” on page 2 • added “calibrate command” in Section 2 “Features and benefits” on page 2 • redesign of Figure 1 “Block diagram of G2X IC” on page 4 • merging of Fig. 2 Pinning and Fig. 3 Wafer layout - see Figure 2 “Wafer layout and pinning information” on page 5 • added type “FCS2 Polymer Strap - SOT1040AA1” in Section 4 “Ordering information”, Section 6 “Wafer layout and pinning information”, Section 7 “Package outline”, Section 8 “Mechanical specification”, Section 9 “Limiting values”, Section 10 “Characteristics” • added Section 11 “Handling information for Flip Chip Strap (FCS2, SOT1040)” on page 19 • added Section 12 “Packing information” on page 20 • added Table 13 “Symbol description” on page 22 • correction of Table 16 “Memory map” on page 30 • removed “ongoing” in 32 bit ongoing in Section 2.1 and Table 15 “G2X memory sections” 139031 20080428 Product data sheet 139030 |
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