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SL3ICS1002 датащи(PDF) 20 Page - NXP Semiconductors |
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SL3ICS1002 датащи(HTML) 20 Page - NXP Semiconductors |
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20 / 56 page ![]() 139036 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.6 — 10 March 2011 139036 20 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 12. Packing information 12.1 Flip Chip Strap (FCS2, SOT1040) The strap is shipped on a 13 inch by 9 mm reel. For details please refer to Ref. 21 “Data sheet - Flip chip strap - FCS2, General packing specification, BL-ID document number: 1738**”. 12.2 Wafer See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on UV-tape with electronic fail die marking, BL-ID document number: 1093**”. 12.3 TSSOP See http://www.standardics.nxp.com/packaging/packing/pdf/sot505-2.t4.pdf. 12.4 SOT1122 Part orientation T1. For details please refer to http://www.standardics.nxp.com/packaging/packing/pdf/sot886.t1.t4.pdf. |
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