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THS6204IPWPR датащи(PDF) 3 Page - Texas Instruments |
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THS6204IPWPR датащи(HTML) 3 Page - Texas Instruments |
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3 / 43 page ![]() DISSIPATION RATINGS RECOMMENDED OPERATING CONDITIONS PIN CONFIGURATIONS (1)(2)(3) V S- BIAS-1/D1D2 BIAS-2/D1D2 D1IN+ D2IN+ GND I ADJ D3IN+ D4IN+ BIAS-2/D3D4 BIAS-1/D3D4 V S- V S+ D1OUT D1IN- D2IN- D2OUT NC (4) NC (4) D3OUT D3IN- D4IN- D4OUT V S+ 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 PowerPAD D1IN+ D2IN+ GND I ADJ NC (4) D3IN+ D2IN- D2OUT NC (4) D3OUT D3IN- D4IN- 1 2 3 4 5 6 18 17 16 15 14 13 PowerPAD 19 D4IN+ D1IN- 7 THS6204 www.ti.com ................................................................................................................................................... SBOS416C – OCTOBER 2007 – REVISED APRIL 2009 POWER RATING(3) (TJ = +130°C) PACKAGE θ JC (°C/W) θ JA (°C/W) (1) (2) TA = +25°C TA = +85°C QFN-24 (RHF) 1.7 32 3.28W 1.4W HTSSOP-24 (PWP) 0.92 31 3.39W 1.45W (1) This data was taken using a 4-layer, 3in × 3in (76.2mm × 76.2mm) test PCB with the PowerPAD soldered to the PCB. If the PowerPAD is not soldered to the PCB, θ JA increases to +74°C/W for the RHF package and +62°C/W for the PWP package. (2) For high-power dissipation applications, soldering the PowerPAD to the PCB is required. Failure to do so may result in reduced reliability and/or lifetime of the device. See TI technical brief SLMA002 for more information about utilizing the PowerPAD thermally enhanced package. (3) Power rating is determined with a junction temperature of +130°C. This is the point where distortion starts to substantially increase and long-term reliability starts to be reduced. Thermal management of the final PCB should strive to keep the junction temperature at or below +130°C for best performance and reliability. THS6204 MIN MAX UNIT Dual supply ±5 ±14 V Supply voltage, VS– to VS+ Single supply 10 28 V Operating free-air temperature, TA –40 +85 °C Operating junction temperature, continuous operating temperature, TJ, QFN package –40 +130 °C Operating junction temperature, continuous operating temperature, TJ, TSSOP package –40 +140 °C Normal storage temperature, TSTG –40 +85 °C QFN-24(4) HTSSOP-24(4) RHF PACKAGE PWP PACKAGE (TOP VIEW) (TOP VIEW) (1) The PowerPAD is electrically isolated from all other pins and can be connected to any potential voltage range from VS– to VS+. Typically, the PowerPAD is connected to the GND plane as this plane tends to physically be the largest and is able to dissipate the most amount of heat. (2) The THS6204 defaults to shutdown mode if no signal is present on the bias pins. (3) The GND pin range is from VS– to (VS+ – 5V). (4) NC = no connection. Copyright © 2007–2009, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): THS6204 |
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