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THS6204IPWPR датащи(PDF) 3 Page - Texas Instruments

номер детали THS6204IPWPR
подробное описание детали  Dual-Port, Differential VDSL2 Line Driver Amplifiers
PDF  43 Pages
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производитель  TI [Texas Instruments]
домашняя страница  http://www.ti.com
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THS6204IPWPR датащи(HTML) 3 Page - Texas Instruments

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DISSIPATION RATINGS
RECOMMENDED OPERATING CONDITIONS
PIN CONFIGURATIONS
(1)(2)(3)
V
S-
BIAS-1/D1D2
BIAS-2/D1D2
D1IN+
D2IN+
GND
I
ADJ
D3IN+
D4IN+
BIAS-2/D3D4
BIAS-1/D3D4
V
S-
V
S+
D1OUT
D1IN-
D2IN-
D2OUT
NC
(4)
NC
(4)
D3OUT
D3IN-
D4IN-
D4OUT
V
S+
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
PowerPAD
D1IN+
D2IN+
GND
I
ADJ
NC
(4)
D3IN+
D2IN-
D2OUT
NC
(4)
D3OUT
D3IN-
D4IN-
1
2
3
4
5
6
18
17
16
15
14
13
PowerPAD
19
D4IN+
D1IN-
7
THS6204
www.ti.com ................................................................................................................................................... SBOS416C – OCTOBER 2007 – REVISED APRIL 2009
POWER RATING(3)
(TJ = +130°C)
PACKAGE
θ
JC (°C/W)
θ
JA (°C/W)
(1) (2)
TA = +25°C
TA = +85°C
QFN-24 (RHF)
1.7
32
3.28W
1.4W
HTSSOP-24 (PWP)
0.92
31
3.39W
1.45W
(1)
This data was taken using a 4-layer, 3in × 3in (76.2mm × 76.2mm) test PCB with the PowerPAD soldered to the PCB. If the PowerPAD
is not soldered to the PCB,
θ
JA increases to +74°C/W for the RHF package and +62°C/W for the PWP package.
(2)
For high-power dissipation applications, soldering the PowerPAD to the PCB is required. Failure to do so may result in reduced reliability
and/or lifetime of the device. See TI technical brief SLMA002 for more information about utilizing the PowerPAD thermally enhanced
package.
(3)
Power rating is determined with a junction temperature of +130°C. This is the point where distortion starts to substantially increase and
long-term reliability starts to be reduced. Thermal management of the final PCB should strive to keep the junction temperature at or
below +130°C for best performance and reliability.
THS6204
MIN
MAX
UNIT
Dual supply
±5
±14
V
Supply voltage, VS– to VS+
Single supply
10
28
V
Operating free-air temperature, TA
–40
+85
°C
Operating junction temperature, continuous operating temperature, TJ, QFN package
–40
+130
°C
Operating junction temperature, continuous operating temperature, TJ, TSSOP package
–40
+140
°C
Normal storage temperature, TSTG
–40
+85
°C
QFN-24(4)
HTSSOP-24(4)
RHF PACKAGE
PWP PACKAGE
(TOP VIEW)
(TOP VIEW)
(1)
The PowerPAD is electrically isolated from all other pins and can be connected to any potential voltage range from
VS– to VS+. Typically, the PowerPAD is connected to the GND plane as this plane tends to physically be the largest
and is able to dissipate the most amount of heat.
(2)
The THS6204 defaults to shutdown mode if no signal is present on the bias pins.
(3)
The GND pin range is from VS– to (VS+ – 5V).
(4)
NC = no connection.
Copyright © 2007–2009, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): THS6204



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