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33982 датащи(PDF) 32 Page - Freescale Semiconductor, Inc

номер детали 33982
подробное описание детали  Single Intelligent High-current Self-protected High Side Switch (2.0 mOhm)
PDF  36 Pages
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производитель  FREESCALE [Freescale Semiconductor, Inc]
домашняя страница  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

33982 датащи(HTML) 32 Page - Freescale Semiconductor, Inc

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Analog Integrated Circuit Device Data
32
Freescale Semiconductor
33982
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 4.0)
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 4.0)
Introduction
This thermal addendum is provided as a supplement to the 33982 technical
datasheet. The addendum provides thermal performance information that may be
critical in the design and development of system applications. All electrical,
application, and packaging information is provided in the datasheet.
Packaging and Thermal Considerations
This package is a dual die package. There are two heat sources in the package
independently heating with P1 and P2. This results in two junction temperatures,
TJ1 and TJ2, and a thermal resistance matrix with RθJAmn.
For m, n = 1, RθJA11 is the thermal resistance from Junction 1 to the reference
temperature while only heat source 1 is heating with P1.
For m = 1, n = 2, RθJA12 is the thermal resistance from Junction 1 to the
reference temperature while heat source 2 is heating with P2. This applies to RθJ21
and RθJ22, respectively.
The stated values are solely for a thermal performance comparison of one
package to another in a standardized environment. This methodology is not meant to and will not predict the performance of a
package in an application-specific environment. Stated values were obtained by measurement and simulation according to the
standards listed below.
Standards
Figure 13. Surface Mount for Power PQFN
with Exposed Pads
High Side Switch
33982
98ARL10521D
16-PIN PQFN
12 mm x 12 mm
Note For package dimensions, refer to
98ARL10521D.
TJ1
TJ2
=
RθJA11
RθJA21
RθJA12
RθJA22
.
P1
P2
Table 19. Thermal Performance Comparison
Thermal
Resistance
1 = Power Chip, 2 = Logic Chip [
°C/W]
m = 1,
n = 1
m = 1, n = 2
m = 2, n = 1
m = 2,
n = 2
RθJAmn
(1), (2)
20
16
39
RθJBmn
(2), (3)
62.0
26
RθJAmn
(1), (4)
53
40
73
RθJCmn
(5)
<0.5
0.0
1.0
Notes:
1.
Per JEDEC JESD51-2 at natural convection, still air
condition.
2.
2s2p thermal test board per JEDEC JESD51-7and
JESD51-5.
3.
Per JEDEC JESD51-8, with the board temperature on the
center trace near the power outputs.
4.
Single layer thermal test board per JEDEC JESD51-3 and
JESD51-5.
5.
Thermal resistance between the die junction and the
exposed pad, “infinite” heat sink attached to exposed pad.
Note: Recommended via diameter is 0.5 mm. PTH (plated through
hole) via must be plugged / filled with epoxy or solder mask in order
to minimize void formation and to avoid any solder wicking into the
via.
1.0
1.0
0.2
0.2
* All measurements
are in millimeters



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