IXD_609

12

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R02

5.4.3 Tape & Reel Information for SI and SIA Packages

5.4.4 YI (5-Pin TO-263)

NOTES:

1. A

2. 10 pitches cumulative tol. ± 0.2mm

3. ( ) Reference dimensions only.

4. Unless otherwise specified, all dimensions in millimeters.

K

B

R0.50 TYP

8.00 ± 0.10

2.00 ± 0.10

4.00 ± 0.10 See Note #2

12.00 ± 0.30

5.50 ± 0.10

1.75 ± 0.10

∅1.50 (MIN)

∅1.55 ± 0.05

1.80 ± 0.10

(3.40)

0.30 ± 0.05

(70º)

A

(4.70)

(1.20)

A

A

B

B

SECTION A-A

SECTION B-B

Embossment

Embossed Carrier

Top Cover

Tape Thickness

0.102 MAX.

(0.004 MAX.)

330.2 DIA.

(13.00 DIA.)

DIMENSIONS

mm MIN / mm MAX

(inches MIN / inches / MAX)

NOTES:

1. All metal surfaces are solder-plated except trimmed area.

2. Short lead of No. 3 is optional to IXYS.

3. No. 3 lead is connected to No. 6 lead (bottom heat sink) internally.

8.80 / 9.50

(0.346 / 0.374)

14.80 / 15.80

(0.583 / 0.622)

9.65 / 10.30

(0.380 / 0.406)

1.70 BSC

(0.067 BSC)

1 2 3 4 5

0.60 / 0.99

(0.024 / 0.039)

1.00 / 1.40

(0.039 / 0.055)

4.20 / 4.80

(0.165 / 0.189)

1.20 / 1.40

(0.047 / 0.055)

0.40 / 0.70

(0.016 / 0.028)

2.24 / 2.84

(0.088 / 0.112)

2.10 / 2.70

(0.083 / 0.106)

0º - 3º

6.60 / 7.20

(0.260 / 0.283)

7.50 / 8.20

(0.295 / 0.323)

1.20 / 1.70

(0.047 / 0.067)

6

Optional

3.85

(0.152)

3.65

(0.144)

6.35

(0.250)

1.05

(0.041)

1.70

(0.067)

10.40

(0.409)

9.15

(0.360)

Recommended PCB Pattern