IXD_609

R02

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11

5.4 Mechanical Dimensions

5.4.1 SIA (8-Pin SOIC)

5.4.2 SI (8-Pin Power SOIC with Exposed Metal Back)

Recommended PCB Land Pattern

Dimensions

mm MIN / mm MAX

(inches MIN / inches MAX)

1.30 / 1.75

(0.051 / 0.069)

0.10 / 0.25

(0.004 / 0.010)

4.80 / 5.00

(0.190 / 0.197)

PIN 1

0.31 / 0.51

(0.012 / 0.020)

5.80 / 6.20

(0.228 / 0.244)

3.80 / 4.00

(0.150 / 0.157)

1.27 BSC

(0.05 BSC)

0.40 / 1.27

(0.016 / 0.050)

0.10 / 0.25

(0.004 / 0.010)

0.25 / 0.50 x45º

(0.010 / 0.020 x45º)

0º / 8º

1.27

(0.050)

5.40

(0.213)

1.55

(0.061)

0.60

(0.024)

NOTE: Molded package conforms to JEDEC standard configuration

MS-012 variation AA.

Recommended PCB Land Pattern

Dimensions

mm MIN / mm MAX

(inches MIN / inches MAX)

NOTES:

1. Molded package conforms to JEDEC standard configuration

MS-012 variation BA.

2. The exposed metal pad on the back of the SI package should

be connected to GND. It is not suitable for carrying

current.

1.30 / 1.75

(0.051 / 0.069)

0.03 / 0.10

(0.001 / 0.004)

4.80 / 5.00

(0.190 / 0.197)

PIN 1

0.31 / 0.51

(0.012 / 0.020)

5.80 / 6.20

(0.228 / 0.244)

3.80 / 4.00

(0.150 / 0.157)

1.27 BSC

(0.05 BSC)

0.40 / 1.27

(0.016 / 0.050)

0.10 / 0.25

(0.004 / 0.010)

0.25 / 0.50 x45º

(0.010 / 0.020 x45º)

0º / 8º

2.29 / 2.79

(0.090 / 0.110)

3.30 / 3.81

(0.130 / 0.150)

1.27

(0.050)

5.40

(0.209)

1.55

(0.061)

0.60

(0.024)

2.75

(0.108)

3.80

(0.150)