3

Precision Edge®

SY58034U

Micrel, Inc.

M9999-082707

hbwhelp@micrel.com or (408) 955-1690

Termination Current

Source or sink current on VT pin ........................ ±100mA

Input Current

Source or sink current on IN, /IN pin .................... ±50mA

Source or sink current on VREF-AC pin ................. ±2mA

Lead Temperature (soldering, 20 sec.) ..................... 260°C

............................................................. +3.0V to +3.6V

θ

Still-Air ............................................................. 35°C/W

ψ

Junction-to-Board ............................................ 16°C/W

Symbol

Parameter

Condition

Min

Typ

Max

Units

Power Supply Voltage

2.375

2.5

2.625

V

3.0

3.3

3.6

V

Power Supply Current

245

320

mA

Differential Input Resistance

90

100

110

ý

|IN–/IN|

Input Resistance (IN-to-VT)

45

50

55

ý

Input HIGH Voltage (IN, /IN)

Note 5

V

Input LOW Voltage (IN, /IN)

0

V

Input Voltage Swing (IN, /IN)

See Figure 1a.

0.1

1.7

V

Differential Input Voltage Swing

See Figure 1b.

0.2

V

|IN, /IN|

1.28

V

Reference Voltage

V

Notes:

1. Permanent device damage may occur if the measurements in the “Absolute Maximum Ratings” section are exceeded. This is a stress rating only

and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute

maximum ratings conditions for extended periods may affect device reliability.

2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

3. Thermal performance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB.

Ψ

determined for a 4-layer board in a still air, unless otherwise stated.

4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.