SX8663 datasheet(7/64 Pages) SEMTECH

7 / 64 page

ADVANCED COMMUNICATIONS & SENSING

Rev5 4

th August 2011

www.semtech.com

SX8663

Capacitive Button Matrix (up to 36) and Proximity Controller

with Individual LED Drivers and Buzzer Output

ELECTRICAL CHARACTERISTICS

2.1

Absolute Maximum Ratings

Stresses above the values listed in “Absolute Maximum Ratings” may cause permanent damage to the device.

This is a stress rating only and functional operation of the device at these, or any other conditions beyond the “Recommended

Operating Conditions”, is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device

reliability

Parameter

Symbol

Min.

Max.

Unit

Supply Voltage

VDD

-0.5

3.9

Input voltage (non-supply pins)

VIN

-0.5

3.9

Input current (non-supply pins)

IIN

Operating Junction Temperature

TJCT

125

°C

Reflow temperature

TRE

260

°C

Storage temperature

TSTOR

-50

150

°C

ESD HBM (Human Body model)

(i)

ESDHBM

Latchup

(ii)

ILU

± 100

Table 2

Absolute Maximum Ratings

(i) Tested to JEDEC standard JESD22-A114

(ii) Tested to JEDEC standard JESD78

2.2

Recommended Operating Conditions

Parameter

Symbol

Min.

Max.

Unit

Supply Voltage

VDD

2.7

3.6

Supply Voltage Drop

(iii, iv, v)

VDDdrop

100

Supply Voltage for NVM programming

VDD

3.0

3.6

Ambient Temperature Range

-40

°C

Table 3

Recommended Operating Conditions

(iii) Performance for 2.6V < VDD < 2.7V might be degraded.

(iv) Operation is not guaranteed below 2.6V. Should VDD briefly drop below this minimum value, then the SX8663 may

require;

- a hardware reset issued by the host using the RESETB pin

- a software reset issued by the host using the I2C interface

(v) In the event the host processor is reset or undergoes a power OFF/ON cycle, it is recommended that the host also resets

the SX8663 and assures that parameters are re-written into the SPM (should these differ to the parameters held in NVM).

2.3

Thermal Characteristics

Parameter

Symbol

Min.

Max.

Unit

Thermal Resistance - Junction to Ambient

(vi)

θJA

°C/W

Table 4

Thermal Characteristics

(vi) Static airflow

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