Document Number: 51058

www.vishay.com

Revision: 19-Jul-11

23

D2TO35

Surface Mounted Power Resistor

Thick Film Technology

Vishay Sfernice

This document is subject to change without notice.

POWER RATING

The temperature of the case should be maintained within the

limits specified.

MECHANICAL SPECIFICATIONS

Mechanical Protection

Molded

Resistive Element

Thick film

Substrate

Alumina

Connections

Tinned copper

Weight

2.2 g max.

ENVIRONMENTAL SPECIFICATIONS

Temperature Range

- 55 °C to 175 °C

Flammability

IEC 60695-11-5

2 applications 30 s

separated by 60 s

DIMENSIONS

Standard Package

TO-263 style

100

75

50

25

0

CASE TEMPERATURE IN °C

120

0

20

40

60

80

100

120

140

160

175

PERFORMANCE

TESTS

CONDITIONS

REQUIREMENTS

Momentary Overload

IEC 60115-1 §4.13

± (0.25 % + 0.005

)

Rapid Temperature Change

IEC 60115-1

Test Na

5 cycles - 1 h

- 55 °C to + 175 °C

± (0.5 % + 0.005

)

Load Life

IEC 60115-1

1000 h at + 25 °C

± (1 % + 0.005

)

Humidity (Steady State)

IEC 60115-1

IEC 60068-2-3

Test Ca: 56 days RH 95 %

± (0.5 % + 0.005

)

Vibration

MIL STD 202

Method 204 - Test D

10 to 2000 Hz

± (0.2 % + 0.005

)

Terminal Strength

IEC 60115-1

Test Ua1/Tensile: 20 N/10 s

± (0.2 % + 0.005

)

Shock

IEC 60115-1

IEC 60068-2-27

Saw-tooth: 100 gn/6 ms

± (0.5 % + 0.005

)

ASSEMBLY SPECIFICATIONS

For the assembly on board, we recommend the lead (Pb)-free thermal profile as per J-STD-020C

TESTS

CONDITIONS

REQUIREMENTS

Resistance to Soldering Heat

IEC 60115-1

IEC 60068-2-58

Solder bath method: 270 °C/10 s

± (0.5 % + 0.005

)

Moisture Sensitivity Level (MSL)

IPC/JEDEC J-STD-020C

85 °C/85 % RH/168 h

Level: 1

+ pass requirements of TCR

overload and dielectic strength after MSL