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EPC111 датащи(PDF) 12 Page - Espros Photonics corp |
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EPC111 датащи(HTML) 12 Page - Espros Photonics corp |
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12 / 14 page ![]() epc111/112 Mechanical dimension QFN16 Package LST Mechanical dimension SOT23-6L LST Top view 2.9 - 3.1 1.9 0.25 15.08.2010 Page 1 File: This document is confidential and protected by law and international trades. It must not be shown to any third party nor be copied in any form without our written permission . 0.5 Bottom View 0.3 Figure 16: QFN-16: Mechanical dimensions Reflow Solder Profile For infrared or conventional soldering the solder profile has to follow the recommendations of IPC/JEDEC J-STD-020C (min. revision C) for Pb-free assembly for both types of packages. The peak soldering t emperature (TL) should not exceed +260°C for a maximum of 4 sec. © 2011 ESPROS Photonics Corporation Characteristics subject to change without notice 12 Datasheet epc111_112 - V2.2 www.espros.ch |
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