epc111/112

<Partname>

<x000 000>

<Name>

<Data>

M 1:1

DIN A4

<Name>

Part Name

Part No.

Designed

Approved

Scale

Page

File: Unben annt

1

26.02.2009

)

CSP-10 Package

1.9 +0.0/-0.1

0.5

0.5

0.15

Solder balls Sn97.5Ag2.5

∅ 0.12

Bottom View

Pin 1

19.01.2012

Page 1

File:

This document is confidential and protected by law and international trades. It must not be shown to any third party nor be copied in any form without our written permission

.

no solder mask inside this area

0.5

0.5

∅ 0.3

2.5

0.1524

Figure 13: CSP10: Mechanical dimensions

Figure 14: CSP10: Layout recommendation

Recommendations for reliable soldering of solder balls:

•

Use a pad layout similar to the one shown in Figure 14. Notice that all tracks should go underneath the solder mask area.

•

Do not connect any pins direct pin to pin inside of the opening of the solder mask.

•

In case of the conductors are with a Au-Ni surface finish the preferred landing pad design for the solder balls will be covering the

round landing pad with a gold surface finish as a solderable area only.

QFN-16 Package

PIN Connections QFN16-VEED-

1VN4

LST

11.01.2011

Page 1

File:

This document is confidential and protected by law and international trades. It must not be shown to any third party nor be copied in any form without our written permission

.

PIN Connections QFN16-VEED-

1VN4

LST

Top View

1

2

3

4

PD

GND

LED

NC

NC_GND

NC_GND

NC_GND

NC_GND

Opening in solder mask

Conductor layout

Shielding of PD pin

Figure 15: QFN-16: Layout recommendation

© 2011 ESPROS Photonics Corporation

Characteristics subject to change without notice

11

Datasheet epc111_112 - V2.2

www.espros.ch