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BLF888AS датащи(PDF) 3 Page - NXP Semiconductors |
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BLF888AS датащи(HTML) 3 Page - NXP Semiconductors |
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3 / 17 page ![]() BLF888A_BLF888AS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 3 — 30 August 2011 3 of 17 NXP Semiconductors BLF888A; BLF888AS UHF power LDMOS transistor 5. Thermal characteristics [1] Rth(j-c) is measured under RF conditions. 6. Characteristics [1] ID is the drain current. [2] Capacitance values without internal matching. Table 5. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-c) thermal resistance from junction to case Tcase =80 C; PL(AV) = 125 W [1] 0.15 K/W Table 6. DC characteristics Tj =25 C; per section unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit V(BR)DSS drain-source breakdown voltage VGS =0V; ID = 2.4 mA [1] 110 - - V VGS(th) gate-source threshold voltage VDS =10 V; ID = 240 mA [1] 1.4 1.9 2.4 V IDSS drain leakage current VGS =0V; VDS = 50 V --2.8 A IDSX drain cut-off current VGS =VGS(th) +3.75 V; VDS =10V -36 - A IGSS gate leakage current VGS =10V; VDS = 0 V - - 280 nA RDS(on) drain-source on-state resistance VGS =VGS(th) +3.75 V; ID =8.5 A [1] -143 - m Ciss input capacitance VGS = 0 V; VDS =50V; f= 1MHz [2] -220 - pF Coss output capacitance VGS = 0 V; VDS =50V; f= 1MHz -74 - pF Crss reverse transfer capacitance VGS = 0 V; VDS =50V; f= 1MHz -1.2 - pF Table 7. RF characteristics RF characteristics in NXP production narrowband test circuit; Tcase =25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 2-Tone, class-AB VDS drain-source voltage - 50 - V IDq quiescent drain current [1] -1.3 - A PL(AV) average output power f1 = 860 MHz; f2 =860.1 MHz 250 - - W Gp power gain f1 = 860 MHz; f2 =860.1 MHz 20 21 - dB D drain efficiency f1 = 860 MHz; f2 =860.1 MHz 42 46 - % IMD3 third-order intermodulation distortion f1 = 860 MHz; f2 =860.1 MHz - 32 28 dBc |
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