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CSD75211W1723 датащи(PDF) 1 Page - Texas Instruments

номер детали CSD75211W1723
подробное описание детали  Dual P-Channel NexFET??Power MOSFET
PDF  8 Pages
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производитель  TI [Texas Instruments]
домашняя страница  http://www.ti.com
Logo TI - Texas Instruments

CSD75211W1723 датащи(HTML) 1 Page - Texas Instruments

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background image
P0114-01
D1
D1
S
S
D1
G1
G2
S
D2
D2
D2
S
-VGS - Gate-to-Source Voltage - V
0
1
2
3
4
5
6
7
8
0
10
20
30
40
50
60
70
80
TC = 25°C
TC = 125°C
G006
ID = -2A
-VGS - Gate-to-Source Voltage - V
0
1
2
3
4
5
6
7
8
0
20
40
60
80
100
120
140
TC = 25°C
TC = 125°C
G013
ID = −2A
CSD75211W1723
www.ti.com
SLPS250A
– MAY 2010 – REVISED AUGUST 2011
Dual P-Channel NexFET
™ Power MOSFET
Check for Samples: CSD75211W1723
PRODUCT SUMMARY
1
FEATURES
VDS
Drain to Source Voltage
-20
V
Dual P-Ch MOSFETs
Qg
Gate Charge Total (-4.5V)
4.5
nC
Common Source Configuration
Qgd
Gate Charge Gate to Drain
0.9
nC
Small Footprint 1.7 mm
× 2.3 mm
VGS = -1.8V
50
m
RDS(on)
Drain to Source On Resistance
VGS = -2.5V
39
m
Ultra Low Qg and Qgd
VGS = -4.5V
32
m
Pb Free
VGS(th)
Threshold Voltage
-0.7
V
RoHS Compliant
Halogen Free
Text Added for Spacing
ORDERING INFORMATION
APPLICATIONS
Device
Package
Media
Qty
Ship
Battery Management
1.7-mm
× 2.3-mm
7-Inch
Tape and
CSD75211W1723
Wafer Level
3000
Reel
Reel
Battery Protection
Package
DC-DC Converters
Text Added for Spacing
ABSOLUTE MAXIMUM RATINGS
DESCRIPTION
TA = 25°C unless otherwise stated
VALUE
UNIT
The device has been designed to deliver the lowest
VDS
Drain to Source Voltage
-20
V
on resistance and gate charge in the smallest outline
possible with thermal characteristics in an ultra low
VGS
Gate to Source Voltage
±8
V
profile. Low on resistance and gate charge coupled
Continuous Drain Current (1) (2)(3)
ID
-4.5
A
with the small footprint and low profile make the
Pulsed Drain Current (1) (2)(3)
device ideal for battery operated space constrained
Continupus Gate Clamp Current (4)
IG
-6
A
application in load management as well as DC-DC
Pulsed Gate Clamp Current (4)
converter applications
PD
Power Dissipation (1)
1.5
W
Top View
TJ,
Operating Junction and Storage
–55 to 150
°C
TSTG
Temperature Range
(1) May be limited by Max source current
(2) Based on Min Cu footprint
(3) Per MOSFET
(4) Total for device
RDS(on) vs VGS
RD1D2(on) vs VGS
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright
© 2010–2011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.


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