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TMP006 датащи(PDF) 1 Page - Texas Instruments

номер детали TMP006
подробное описание детали  Infrared Thermopile Sensor in Chip-Scale Package
PDF  17 Pages
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производитель  TI1 [Texas Instruments]
домашняя страница  http://www.ti.com
Logo TI1 - Texas Instruments

TMP006 датащи(HTML) 1 Page - Texas Instruments

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background image
20
15
10
5
0
-
3
3
T
Error( C)
°
Object
-
1
2
1
-
2
0
T
=
Object
Local
20 C
T
=20 C
°
°
-
s
3
+3 s
16-Bit
DS
ADC
Gain
Local
Temperature
IR
Thermopile
Sensor
Voltage
Reference
Sensor
Amplifier
Digital
Control
SMBus
Compatible
DRDY
ADR0
ADR1
SCL
SDA
V+
AGND
DGND
TMP006
TMP006
www.ti.com
SBOS518
– MAY 2011
Infrared Thermopile Sensor in Chip-Scale Package
Check for Samples: TMP006
1
FEATURES
DESCRIPTION
The TMP006 is the first in a series of temperature
23
•
Complete Solution in 1,6 mm
× 1,6 mm Wafer
sensors that measure the temperature of an object
Chip-Scale Package (WCSP) IC (DSBGA)
without the need to make contact with the object. This
•
Digital Output:
sensor uses a thermopile to absorb the infrared
– Sensor Voltage: 7 μV/°C
energy emitted from the object being measured and
– Local Temperature: –40°C to +125°C
uses the corresponding change in thermopile voltage
to determine the object temperature.
•
SMBus
™ Compatible Interface
•
Pin-Programable Interface Addressing
Infrared sensor voltage range is specified from
–40°C
•
Low Supply Current: 240
μA
to +125
°C to enable use in a wide range of
applications. Low power consumption along with low
•
Low Minimum Supply Voltage: 2.2 V
operating
voltage
makes
the
part
suitable
for
battery-powered
applications.
The
low
package
APPLICATIONS
height of the chip-scale format enables standard high
•
Notebook Case Temperature
volume assembly methods, and can be useful where
•
Comfort Index Measurement
limited spacing to the object being measured is
available.
•
Motor Case Temperature
•
Server Farm Power Management
Histogram
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
SMBus is a trademark of Intel Corporation.
3
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright
© 2011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.


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