Device

ADR0

SCL

V+

A3

C3

C1

A1

SDA

B3

C2

B1

ADR1

A2

AGND

DGND

DRDY

C >0.01

F

m

F

TMP006

SBOS518

– MAY 2011

www.ti.com

OVERVIEW

The TMP006 is a digital temperature sensor that is optimal for thermal management and thermal protection

applications where remote non-contact sensing is desired. The TMP006 is two-wire and SMBus interface

compatible, and is specified over the ambient temperature range of

–40°C to +125°C. The TMP006 measures

object temperatures over a temperature range of

–40°C to +125°C. The TMP006 contains registers for holding

configuration information, temperature measurement results, and sensor voltage measurement. The ambient

temperature measurement and the sensor voltage measurement are used to calculate the object temperature.

Refer to the TMP006 User Guide (SBOU107) for more details.

The SCL and SDA interface pins require pull-up resistors (10 k

Ω, typical) as part of the communication bus, while

DRDY is an open-drain output that must also use a pull-up resistor. DRDY may be shared with other devices if

desired for a wired-OR implementation. A 0.01-

μF power-supply bypass capacitor is recommended, as shown in

Figure 4.

Figure 4. Typical Connection Diagram

The TMP006 provides both local temperature and the thermopile sensor voltage outputs in a WCSP. The local

temperature sensor in the TMP006 is integrated on-chip; the thermal path runs through the WCSP solder balls.

The low thermal resistance of the solder balls provides the thermal path to maintain the chip at the temperature

of the local environment.

The top side of the WCSP must face the object that is being measured with an unobstructed view in order to

accurately measure the temperature. Refer to the user guide TMP006 Layout and Assembly Guidelines

(SBOU108) for more details.

6

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© 2011, Texas Instruments Incorporated

Product Folder Link(s): TMP006