ADM2682E/ADM2687E

Preliminary Technical Data

Rev. PrE | Page 20 of 20

OUTLINE DIMENSIONS

Figure 42. 16-Lead Standard Small Outline Package with Increased Creepage [SOIC_IC]

Wide Body,

(RI-16)

Dimensions shown in millimeters and (inches)

ORDERING GUIDE

Model1

Data Rate (Mbps)

Temperature Range

Package Description

Package Option

ADM2682EBRIZ

16

−40°C to +85°C

16-Lead SOIC_IC

RI-16

ADM2682EBRIZ-RL7

16

−40°C to +85°C

16-Lead SOIC_IC

RI-16

ADM2687EBRIZ

0.5

−40°C to +85°C

16-Lead SOIC_IC

RI-16

ADM2687EBRIZ-RL7

0.5

−40°C to +85°C

16-Lead SOIC_IC

RI-16

1

Z = RoHS Compliant Part.

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-013-AC

13.00 (0.5118)

12.60 (0.4961)

0.30 (0.0118)

0.10 (0.0039)

2.65 (0.1043)

2.35 (0.0925)

10.65 (0.4193)

10.00 (0.3937)

7.60 (0.2992)

7.40 (0.2913)

0.75 (0.0295)

0.25 (0.0098)

45°

1.27 (0.0500)

0.40 (0.0157)

COPLANARITY

0.10

0.33 (0.0130)

0.20 (0.0079)

0.51 (0.0201)

0.31 (0.0122)

8°

0°

16

9

8

1

1.27

(0.0500)

BSC

SEATING

PLANE

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registered trademarks are the property of their respective owners.

PR09927-0-5/11(PrE)