AD6649EBZ datasheet(10/40 Pages) AD

10 / 40 page

AD6649

Rev. 0 | Page 10 of 40

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

Electrical

AVDD to AGND

−0.3 V to +2.0 V

DRVDD to AGND

−0.3 V to +2.0 V

VIN+A/VIN+B, VIN−A/VIN−B to AGND

−0.3 V to AVDD + 0.2 V

CLK+, CLK− to AGND

−0.3 V to AVDD + 0.2 V

SYNC to AGND

−0.3 V to AVDD + 0.2 V

VCM to AGND

−0.3 V to AVDD + 0.2 V

CSB to AGND

−0.3 V to DRVDD + 0.3 V

SCLK to AGND

−0.3 V to DRVDD + 0.3 V

SDIO to AGND

−0.3 V to DRVDD + 0.3 V

OEB to AGND

−0.3 V to DRVDD + 0.3 V

PDWN to AGND

−0.3 V to DRVDD + 0.3 V

D0−/D0+ through D13−/D13+

to AGND

−0.3 V to DRVDD + 0.3 V

FDA/FDB to AGND

−0.3 V to DRVDD + 0.3 V

OR+/OR− to AGND

−0.3 V to DRVDD + 0.3 V

DCO+/DCO− to AGND

−0.3 V to DRVDD + 0.3 V

Environmental

Operating Temperature Range

(Ambient)

−40°C to +85°C

Maximum Junction Temperature

Under Bias

150°C

Storage Temperature Range

(Ambient)

−65°C to +125°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL CHARACTERISTICS

The exposed paddle must be soldered to the ground plane for

the LFCSP package. Soldering the exposed paddle to the

customer board increases the reliability of the solder joints,

maximizing the thermal capability of the package.

Table 7. Thermal Resistance

Package

Type

Airflow

Velocity

(m/sec)

θJA1,2

θJC1,3

θJB1,4

Unit

26.8

1.14

10.4

°C/W

1.0

21.6

°C/W

64-Lead LFCSP

9 mm × 9 mm

(CP-64-4)

2.0

20.2

°C/W

1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.

2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

3 Per MIL-Std 883, Method 1012.1.

4 Per JEDEC JESD51-8 (still air).

Typical θJA is specified for a 4-layer PCB with solid ground

plane. As shown in Table 7, airflow increases heat dissipation,

which reduces θJA. In addition, metal in direct contact with the

package leads from metal traces, through holes, ground, and

power planes, reduces the θJA.

ESD CAUTION

AD6649EBZ датащи(PDF) 10 Page - Analog Devices

AD6649EBZ датащи(HTML) 10 Page - Analog Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40

датащи скачать

ссылки URL