MPC5645B datasheet(59/114 Pages) FREESCALE

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MPC5646C Microcontroller Data Sheet, Rev. 3

Preliminary—Subject to Change Without Notice

Freescale Semiconductor

Table 24. Low voltage power domain electrical characteristics

Symbol

Parameter

Conditions1

1 V

DD = 3.3 V ± 10% / 5.0 V ± 10%, TA = 40 to 125 °C, unless otherwise specified All temperatures are based on

an ambient temperature.

Value

Unit

Min

Typ2

2 Target typical current consumption for the following typical operating conditions and configuration. Process =

typical, Voltage = 1.2 V.

Max3

3 Target maximum current consumption for mode observed under typical operating conditions. Process = Fast,

Voltage = 1.32 V.

IDDMAX

4 Running consumption is given on voltage regulator supply (V

DDREG). It does not include consumption linked to I/Os

toggling. This value is highly dependent on the application. The given value is thought to be a worst case value with

all cores and peripherals running, and code fetched from code flash while modify operation on-going on data flash.

It is to be noticed that this value can be significantly reduced by application: switch-off not used peripherals (default),

reduce peripheral frequency through internal prescaler, fetch from RAM most used functions, use low power mode

when possible.

CC D RUN mode maximum

average current

—

210

3005,6

5 Higher current may sunk by device during power-up and standby exit. Please refer to in rush current in Table 22.

6 Maximum “allowed” current is package dependent.

IDDRUN

CC T RUN mode typical average

current7

7 Only for the “P” classification: Code fetched from RAM: Serial IPs CAN and LIN in loop back mode, DSPI as Master,

PLL as system Clock (4 x Multiplier) peripherals on (eMIOS/CTU/ADC) and running at max frequency, periodic

SW/WDG timer reset enabled. RUN current measured with typical application with accesses on both code flash

and RAM.

at 120 MHz

TA = 25 °C

—

1758,9

8 Subject to change, Configuration: 1  e200z4d + 4 kbit/s Cache, 1  eDMA (32 ch), 4  FlexCAN (2  500 kbit/s,

2  125 kbit/s), 10  LINFlexD (20 kbit/s), 8  DSPI (4  2 Mbit/s, 3  4Mbit/s, 1  10 Mbit/s), 40  PWM (200 Hz),

40  ADC Input, 1  CTU (40 ch.), 1  FlexRay (2 ch., 10 Mbit/s), 1  RTC, 4  PIT, 1  SWT, 1  STM. Ethernet

and e200z0h disabled. Also reduced timed I/O channels for smaller packages. RUN current measured with typical

application with accesses on both code flash and RAM.

2409,10

Tat 80 MHz

TA = 25 °C

1108

15010

IDDHALT

CC P HALT mode current11

—

IDDSTOP

CC P STOP mode current12

No clocks active

TA = 25 °C

—

4009

12009,13 µA

PTA = 150 °C

—

109

309

IDDSTDBY3

(96 KB RAM

retained)

CC P STANDBY3 mode

current14

No clocks active

TA = 25 °C

—

175

µA

PTA = 150 °C

—

1000

3000

µA

IDDSTDBY2

(64 KB RAM

retained)

CC P STANDBY2 mode

current15

No clocks active

TA = 25 °C

—

135

µA

PTA = 150 °C

—

800

2000

µA

IDDSTDBY1

(8 KB RAM

retained)

CC T STANDBY1 mode

current16

No clocks active

TA = 25 °C

—

µA

PTA = 150 °C

—

500

1000

µA

Adders in LP

mode

CC T 32 kHz OSC

—

TA =25°C

—

µA

4–40 MHz OSC

—

TA =25°C

—

16 MHz IRC

—

TA =25°C

—

500

µA

128 kHz IRC

—

TA =25°C

—

µA

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