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MM912G634CV2AP датащи(PDF) 2 Page - Freescale Semiconductor, Inc |
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MM912G634CV2AP датащи(HTML) 2 Page - Freescale Semiconductor, Inc |
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2 / 345 page ![]() Ordering Information MM912_634 Advance Information, Rev. 4.0 Freescale Semiconductor 2 1 Ordering Information Table 1. ORDERING INFORMATION Device (Add an R2 suffix for Tape and Reel orders) Temperature Range (TA) Package Max. Bus Frequency in MHz (fBUSMAX) Flash (kB) Data Flash (kB) RAM (kB) Analog Option(1) MM912G634CM1AE -40°C to 125°C LQFP48-EP 20 48(2) 2(3) 2(4) A1 MM912G634CV1AE -40°C to 105°C LQFP48-EP 20 48(2) 2(3) 2(4) A1 MM912G634CV2AP -40°C to 105°C LQFP48 16 48(2) 2(3) 2(4) A2 MM912H634CM1AE -40°C to 125°C LQFP48-EP 20 64 4 6 A1 MM912H634CV1AE -40°C to 105°C LQFP48-EP 20 64 4 6 A1 Note: 1. See Table 2. 2. The 48 kB Flash option (MM912G634) using the same S12I64 MCU with the tested FLASHSIZE reduced to 48 kB. This will limit the usable Flash area to the first 48 kB (0x3_4000-0x3_FFFF). 3. The 48 kB Flash option (MM912G634) using the same S12I64 MCU with the tested Data - FLASHSIZE reduced to 2.0 kB. This will limit the usable Data Flash area to the first 2.0 kB (0x0_4400-0x0_4BFF). 4. The 48 kB Flash option (MM912G634) using the same S12I64 MCU with the tested RAMSIZE reduced to 2.0 kB. This will limit the usable RAM area to the first 2.0 kB (0x0_2800-0x0_2FFF). Table 2. Analog Options(5) Feature A1 A2 Battery Sense Module YES YES Current Sense Module YES NO 2nd High Side Output (HS2) YES YES Wake-up Inputs (Lx) L0…L5 L0…L3 Hall Supply Output (HSUP) YES YES LIN Module YES YES Note: 5. This table only highlights the analog die differences between the derivatives. Features highlighted as “NO” or the Lx Inputs not mentioned are not available in the specific option and not bonded out and/or not tested. See Section 4.3.3, “Analog Die Options for detailed information. |
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