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70592C датащи(PDF) 4 Page - Microchip Technology |
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70592C датащи(HTML) 4 Page - Microchip Technology |
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4 / 314 page ![]() PIC24HJXXXGPX06A/X08A/X10A DS70592C-page 4 © 2011 Microchip Technology Inc. Communication Modules: • 3-wire SPI (up to two modules): - Framing supports I/O interface to simple codecs - Supports 8-bit and 16-bit data - Supports all serial clock formats and sampling modes •I2C™ (up to two modules): - Full Multi-Master Slave mode support - 7-bit and 10-bit addressing - Bus collision detection and arbitration - Integrated signal conditioning - Slave address masking • UART (up to two modules): - Interrupt on address bit detect - Interrupt on UART error - Wake-up on Start bit from Sleep mode - 4-character TX and RX FIFO buffers - LIN bus support -IrDA® encoding and decoding in hardware - High-Speed Baud mode - Hardware Flow Control with CTS and RTS • Enhanced CAN (ECAN™ module) 2.0B active (up to two modules): - Up to eight transmit and up to 32 receive buffers - 16 receive filters and 3 masks - Loopback, Listen Only and Listen All Messages modes for diagnostics and bus monitoring - Wake-up on CAN message - Automatic processing of Remote Transmission Requests - FIFO mode using DMA - DeviceNet™ addressing support Analog-to-Digital Converters: • Up to two Analog-to-Digital Converter (ADC) modules in a device • 10-bit, 1.1 Msps or 12-bit, 500 ksps conversion: - Two, four, or eight simultaneous samples - Up to 32 input channels with auto-scanning - Conversion start can be manual or synchronized with one of four trigger sources - Conversion possible in Sleep mode - ±1 LSb max integral nonlinearity - ±1 LSb max differential nonlinearity CMOS Flash Technology: • Low-power, high-speed Flash technology • Fully static design • 3.3V (±10%) operating voltage • Industrial and extended temperature • Low-power consumption Packaging: • 100-pin TQFP (14x14x1 mm and 12x12x1 mm) • 64-pin TQFP (10x10x1 mm) • 64-pin QFN (9x9x0.9 mm) Note: See the device variant tables for exact peripheral features per device. |
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