70592C datasheet(300/314 Pages) MICROCHIP

300 / 314 page

PIC24HJXXXGPX06A/X08A/X10A

DS70592C-page 300

100-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm Footprint [TQFP]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Chamfers at corners are optional; size may vary.

3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Leads

100

Lead Pitch

0.50 BSC

Overall Height

–

1.20

Molded Package Thickness

0.95

1.00

1.05

Standoff

0.05

–

0.15

Foot Length

0.45

0.60

0.75

Footprint

1.00 REF

Foot Angle

0°

3.5°

7°

Overall Width

16.00 BSC

Overall Length

16.00 BSC

Molded Package Width

14.00 BSC

Molded Package Length

14.00 BSC

Lead Thickness

0.09

–

0.20

Lead Width

0.17

0.22

0.27

Mold Draft Angle Top

11°

12°

13°

Mold Draft Angle Bottom

11°

12°

13°

NOTE 1

NOTE 2

12 3

Microchip Technology Drawing C04-110B

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