70592C datasheet(286/314 Pages) MICROCHIP

286 / 314 page

PIC24HJXXXGPX06A/X08A/X10A

DS70592C-page 286

25.1

High Temperature DC Characteristics

TABLE 25-1:

OPERATING MIPS VS. VOLTAGE

TABLE 25-2:

THERMAL OPERATING CONDITIONS

TABLE 25-3:

DC TEMPERATURE AND VOLTAGE SPECIFICATIONS

TABLE 25-4:

DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)

Characteristic

VDD Range

(in Volts)

Temperature Range

(in °C)

Max MIPS

PIC24HJXXXGPX06A/X08A/X10A

3.0V to 3.6V

-40°C to +150°C

Rating

Symbol

Min

Typ

Max

Unit

High Temperature Devices

Operating Junction Temperature Range

-40

—

+155

°C

Operating Ambient Temperature Range

-40

—

+150

°C

Power Dissipation:

Internal chip power dissipation:

PINT = VDD x (IDD -

Σ IOH)

PINT + PI/O

I/O Pin Power Dissipation:

I/O =

Σ ({VDD - VOH} x IOH) + Σ (VOL x IOL)

Maximum Allowed Power Dissipation

PDMAX

(TJ - TA)/

θJA

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature

-40°C

≤TA ≤+150°C for High Temperature

Parameter

No.

Symbol

Characteristic

Min

Typ

Max

Units

Conditions

Operating Voltage

HDC10

Supply Voltage

VDD

—

3.0

3.3

3.6

-40°C to +150°C

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature

-40°C

≤TA ≤+150°C for High Temperature

Parameter

No.

Typical

Max

Units

Conditions

Power-Down Current (IPD)

HDC60e

250

2000

μA

+150°C

3.3V

Base Power-Down Current(1,3)

HDC61c

μA

+150°C

3.3V

Watchdog Timer Current:

ΔIWDT(2,4)

Note 1: Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and

pulled to VSS. WDT, etc., are all switched off, and VREGS (RCON<8>) = 1.

2: The

Δ current is the additional current consumed when the module is enabled. This current should be

added to the base IPD current.

3: These currents are measured on the device containing the most memory in this family.

4: These parameters are characterized, but are not tested in manufacturing.

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