© 2010 Semtech Corporation

Recommended Operating Conditions

Absolute Maximum Ratings

Thermal Information

VIN to PGND, EN to AGND

…………………… -0.3 to +6.0V

BST to LX ………………………………………… -0.3 to +6.0V

BST to PGND……………………………………

-0.3 to +12V

VDD to AGND, VOUT to AGND ………………… -0.3V to +6.0V

FB, PGOOD, TON …………………………… -0.3 to VDD + 0.3V

AGND to PGND…………………………………

-0.3 to +0.3V

Peak IR Reflow Temperature ……………….…………… 260°C

Supply Input Voltage……………………………… 3V to 5.5V

Maximum Continuous Output Current …………………… 3A

Storage Temperature …………………………… -60 to +150°C

Maximum Junction Temperature ……………………… 150°C

Operating Junction Temperature ……………… -40 to +125°C

Exceeding the above specifications may result in permanent damage to the device or device malfunction. Operation outside of the parameters

specified in the Electrical Characteristics section is not recommended.

Electrical Characteristics

Unless specified: V

Parameter

Symbol

Conditions

Min

Typ

Max

Units

Input Supplies

VIN, VDD Input Voltage

3

5.5

V

VDD UVLO Threshold

Rising UVLO V

TH

2.75

2.85

2.98

V

VDD UVLO Hysteresis

100

200

mV

VIN, VDD Supply Current

EN= 0V

5

15

μA

I

(1)

500

Controller

FB On-Time Threshold

0.7425

0.75

0.7575

V

Frequency Programming Range

See R

200

1000

kHz

FB Input Bias Current

FB=VDD or 0V

-1

+1

μA

Timing

On-Time

In Continuous Conduction

V

2.7

3

3.3

μ

s

80

ns

250

ns

NOTES-

(1) Calculated from package in still air, mounted to 3” x 4.5”, 4 layer FR4 PCB with thermal vias under the exposed pad per JESD51 standards.

(2) Tested according to JEDEC standard JESD22-A114-B

(3) Due to parasitic board inductance, the transient LX pin voltage at the point of measurement may appear larger than that which exists on

silicon. The device is designed to tolerate the short duration transient voltages that will appear on the LX pin due to the deadtime diode

conduction, for inductor currents up to the current limit setting of the device. See application section for details.

3

SC173A