Symbol

Parameter

Conditions

Min

(Note 4)

Typ

(Note 5)

Max

(Note 4)

Units

THERMAL SHUTDOWN

Thermal Limit Threshold

(Note 6)

160

°C

Thermal Limit Hysteresis

20

THERMAL RESISTANCE

θ

JA

Junction to Ambient

TSSOP-16

(Note 6, Note 7)

38.0

°C/W

θ

JC

Junction to Case

10.0

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation

of the device is guaranteed and do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical

Characteristics table. All voltages are with respect to the potential at the GND pin, unless otherwise specified.

Note 2: Refer to National’s packaging website for more detailed information and mounting techniques. http://www.national.com/analog/packaging/

Note 3: Human Body Model, applicable std. JESD22-A114-C. Machine Model, applicable std. JESD22-A115-A. Field Induced Charge Device Model, applicable

std. JESD22-C101-C.

Note 4: All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are 100%

production tested. All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality Control (SQC) methods. All limits are used

to calculate Average Outgoing Quality Level (AOQL).

Note 5: Typical numbers are at 25°C and represent the most likely norm.

Note 6: These electrical parameters are guaranteed by design, and are not verified by test.

Note 7: Junction-to-ambient thermal resistance is highly board-layout dependent. In applications where high maximum power dissipation exists, namely driving

a large MOSFET at high switching frequency from a high input voltage, special care must be paid to thermal dissipation issues during board design. In high-power

dissipation applications, the maximum ambient temperature may have to be derated. Maximum ambient temperature (T

operating junction temperature (T

junction-to ambient thermal resistance of the package in the application (

θ

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