Data Sheet

4

V3.1, 2009-01-29

BGF113

Differential Microphone Filter and ESD Protection

BGF113

BGF113

Features

•

Differential microphone filter

•

Integrated ESD protection up to 15 kV contact discharge according to

IEC61000-4-2

•

More than 40 dB stopband attenuation at 1 GHz

•

Wafer Level Package with SnAgCu solder balls

•

RoHS and WEEE compliant package

•400

µm solder ball pitch

WLP-8-6-3D

Description

BGF113 is a differential microphone filter with low pass characteristic offering a high stop band attenuation up to

6 GHz. External pins are protected against 15 kV contact discharge according to IEC61000-4-2. The wafer level

package is a green leadfree package with a size of 1.16 mm x 1.16 mm and a total height of 0.60 mm.

Type

Package

Marking

Chip

BGF113

WLP-8-6

GF113

N0728

D1

D2

C1

800pF

C2

800pF

A2

A3

C3

1250pF

C4

1250pF

R4

R1

C2 (GND)

B3

C3

B1

B2 (GND)

C1

R5

25 Ω

2.2 kΩ

R3

2.2 kΩ

2 kΩ

External IOs

R2

1 kΩ

1 Ω

Figure 1

Schematic