PD-60325

iP2005APbF

Recommended Solder Paste Stencil Design

Notes:

1.This view is stencil squeegee view

2.Dimensions are shown in millimeters

3.This opening is based on using 150 micron thick stencil. If using a different thickness stencil, this opening needs to be

adjusted accordingly.

4.Dashed lines show stencil openings. Solid lines show PCB pad openings.

5.The recommended reflow peak temperature is 260ºC. The total furnace time is approximately 5 minutes with

approximately 10 seconds at peak temperature.

CORNER ID

Figure 16 Solder Paste Stencil Design

Part Marking

Figure 17 Part Marking

www.irf.com

2/8/2008

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