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ST10F272Z2T3 датащи(PDF) 151 Page - STMicroelectronics

номер детали ST10F272Z2T3
подробное описание детали  16-bit MCU with 256 Kbyte Flash memory and 20 Kbyte RAM
PDF  189 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST10F272Z2T3 датащи(HTML) 151 Page - STMicroelectronics

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ST10F272Z2
Electrical characteristics
151/189
Data about maximum input leakage current at each pin are provided in the Data Sheet
(Electrical Characteristics section). Input leakage is greatest at high operating temperatures,
and in general it decreases by one half for each 10°C decrease in temperature.
Considering that, for a 10-bit A/D converter one count is about 5mV (assuming
VAREF = 5 V), an input leakage of 100nA acting though an RL = 50kΩ of external resistance
leads to an error of exactly one count (5mV); if the resistance were 100k
Ω the error would
become two counts.
Eventual additional leakage due to external clamping diodes must also be taken into
account in computing the total leakage affecting the A/D converter measurements. Another
contribution to the total leakage is represented by the charge sharing effects with the
sampling capacitance: being CS substantially a switched capacitance, with a frequency
equal to the conversion rate of a single channel (maximum when fixed channel continuous
conversion mode is selected), it can be seen as a resistive path to ground. For instance,
assuming a conversion rate of 250kHz, with CS equal to 4pF, a resistance of 1MΩ is
obtained (REQ = 1 / fCCS, where fC represents the conversion rate at the considered
channel). To minimize the error induced by the voltage partitioning between this resistance
(sampled voltage on CS) and the sum of RS + RF + RL + RSW + RAD, the external circuit
must be designed to respect the following relation:
The formula above provides a constraints for external network design, in particular on
resistive path.
A second aspect involving the capacitance network shall be considered. Assuming the three
capacitances CF, CP1 and CP2 initially charged at the source voltage VA (refer to the
equivalent circuit reported in Figure 43), when the sampling phase is started (A/D switch
close), a charge sharing phenomena is installed.
Figure 44.
Charge sharing timing diagram during sampling phase
In particular two different transient periods can be distinguished (see Figure 44):
A first and quick charge transfer from the internal capacitance CP1 and CP2 to the
sampling capacitance CS occurs (CS is supposed initially completely discharged):
considering a worst case (since the time constant in reality would be faster) in which
CP2 is reported in parallel to CP1 (call CP = CP1 + CP2), the two capacitance CP and CS
are in series, and the time constant is:
V
A
R
S
R
F
R
L
R
SW
R
AD
++
+
+
R
EQ
------------------------------------------------------------------------------
1
2
---LSB
<
VA
VA1
VA2
t
TS
VCS
Voltage Transient on CS
∆V < 0.5 LSB
1
2
τ1 < (RSW + RAD) CS << TS
τ2 = RL (CS + CP1 + CP2)
τ1 RSW RAD
+
()
=
CP CS
CP CS
+
-----------------------



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