365 datasheet(4/95 Pages) INTEL

4 / 95 page

Datasheet

5.2.5

TCONTROL and Fan Speed Reduction ...........................................................81

5.2.6

Thermal Diode........................................................................................81

Features ....................................................................................................................85

6.1

Power-On Configuration Options ..........................................................................85

6.2

Clock Control and Low Power States.....................................................................85

6.2.1

Normal State .........................................................................................86

6.2.2

HALT and Enhanced HALT Powerdown States..............................................86

6.2.2.1

HALT Powerdown State ..............................................................87

6.2.2.2

Enhanced HALT Powerdown State................................................87

6.2.3

Stop Grant State ....................................................................................87

6.2.4

Enhanced HALT Snoop or HALT Snoop State,

Stop Grant Snoop State...........................................................................88

6.2.4.1

HALT Snoop State, Stop Grant Snoop State ..................................88

6.2.4.2

Enhanced HALT Snoop State .......................................................88

Boxed Processor Specifications .....................................................................................89

7.1

Mechanical Specifications....................................................................................89

7.1.1

Boxed Processor Cooling Solution Dimensions.............................................89

7.1.2

Boxed Processor Fan Heatsink Weight .......................................................91

7.1.3

Boxed Processor Retention Mechanism and Heatsink

Attach Clip Assembly...............................................................................91

7.2

Electrical Requirements ......................................................................................91

7.2.1

Fan Heatsink Power Supply ......................................................................91

7.3

Thermal Specifications........................................................................................93

7.3.1

Boxed Processor Cooling Requirements......................................................93

Debug Tools Specifications ...........................................................................................95

8.1

Logic Analyzer Interface (LAI) .............................................................................95

8.1.1

Mechanical Considerations .......................................................................95

8.1.2

Electrical Considerations ..........................................................................95

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