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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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450 датащи(PDF) 40 Page - Intel Corporation |
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450 датащи(HTML) 40 Page - Intel Corporation |
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40 / 100 page  Package Mechanical Specifications 40 Datasheet 3.5 Package Insertion Specifications The processor can be inserted into and removed from a LGA775 socket 15 times. The socket should meet the LGA775 requirements detailed in the LGA775 Socket Mechanical Design Guide. 3.6 Processor Mass Specification The typical mass of the processor is 21.5 g [0.76 oz]. This mass [weight] includes all the components that are included in the package. 3.7 Processor Materials Table 22 lists some of the package components and associated materials. 3.8 Processor Markings Figure 12 shows the topside markings on the processor. This diagram is to aid in the identification of the processor. Table 22. Processor Materials Component Material Integrated Heat Spreader (IHS) Nickel Plated Copper Substrate Fiber Reinforced Resin Substrate Lands Gold Plated Copper Figure 12. Processor Top-Side Marking Example AT P O S/ N IN TEL ©' 06 4 4 0 CE LER ON ® SL xxx [ C O O ] 2. 00G HZ /5 12 /8 00/ 06 [F PO] M e 4 |
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