33H datasheet(7/54 Pages) RENESAS

номер детали	33H

подробное описание детали	RENESAS MCU

PDF	54 Pages

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производитель	RENESAS [Renesas Technology Corp]

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R8C/33G Group, R8C/33H Group

1. Overview

Under development Preliminary document

Specifications in this document are tentative and subject to change.

REJ03B0306-0010 Rev.0.10

Page 7 of 51

Jul. 21, 2010

(D): Under development

Figure 1.2

Part Number, Memory Size, and Package of R8C/33H Group

Table 1.6

Product List for R8C/33H Group

Current of Jul 2010

Part No.

ROM Capacity

RAM

Capacity

Package Type

Remarks

Program ROM

Data flash

R5F21334HJFP (D)

16 Kbytes

1 Kbyte

× 4

1.5 Kbytes

PLQP0032GB-A J version

R5F21336HJFP (D)

32 Kbytes

1 Kbyte

× 4

2.5 Kbytes

PLQP0032GB-A

R5F21334HKFP (D)

16 Kbytes

1 Kbyte

× 4

1.5 Kbytes

PLQP0032GB-A K version

R5F21336HKFP (D)

32 Kbytes

1 Kbyte

× 4

2.5 Kbytes

PLQP0032GB-A

Part No.

R 5 F 21 33 6 H J FP

Package type:

FP: PLQP0032GB-A (0.8 mm pin-pitch, 7 mm square body)

Classification

J: Operating ambient temperature -40°C to 85°C

K: Operating ambient temperature -40°C to 125°C

ROM capacity

4: 16 KB

6: 32 KB

R8C/33H Group

R8C/3x Series

Memory type

F: Flash memory

Renesas MCU

Renesas semiconductor

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