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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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SC414EVB датащи(PDF) 27 Page - Semtech Corporation |
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SC414EVB датащи(HTML) 27 Page - Semtech Corporation |
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27 / 29 page  SC414/SC424 27 Applications Information (continued) All other decoupling capacitors must be located as close as possible to the IC. PGND Plane PGND requires its own copper plane with no other signal traces routed on it. Copper planes, multiple vias, and wide traces are needed to connect PGND to input capacitors, output capacitors, and the PGND pins on the IC. The PGND copper area between the input capacitors, output capacitors, and PGND pins must be as small as and as compact as possible to reduce the area of the PCB that is exposed to noise due to current flow on this node. Connect PGND to AGND with a short trace or 0Ω resistor. This connection should be as close to the IC as possible. AGND Island AGND should have its own island of copper with no other signal traces routed on this layer that connects the AGND pins and pad of the IC to the analog control components. All of the components for the analog control cir- cuitry should be located so that the connections to AGND are done by wide copper traces or vias down to AGND. Connect PGND to AGND with a short trace or 0Ω resistor. This connection should be as close to the IC as possible. FB, VOUT, and Other Analog Control Signals The connection from the V OUT power to the analog control circuitry must be routed from the output capacitors and located on a quiet layer. The traces between VOUT and the analog control circuitry (VOUT, and FB pins) must be short and routed away from noise sources, such as BST, LX, VIN, and PGND between the input capacitors, output capacitors, and the IC. ILIM and TON nodes must be as short as possible to ensure the best accuracy in current limit and on time. • • • • • • • • • • • R ILIM should be close to the IC and connected to LXS with a Kelvin trace to pin 24 on the IC. This will be a sufficient connection and will prevent the need to connect the resistor further into the LX plane. The feedback components for the switcher need to be as close to the FB pin of the IC as possible to reduce the possibility of noise corrupting these analog signals. BST, ILIM and LX LX and BST are very noisy nodes and must be carefully routed to minimized the PCB area that is exposed to these signals. The connections for the boost capacitor between the IC and LX must be short and directly connected to the LXBST (pin 12). The connections for the current limit resistor between the ILIM pin and LX must be as short as possible and directly connected to pin 24 (LXS). The LX node between the IC and the inductor should be wide enough to handle the inductor current and short enough to eliminate the pos- sibility of LX noise corrupting other signals. Multiple vias should be used to provide a good connection to LX between the IC and the inductor. Capacitors and Current Loops The current loops between the input capacitors, the IC, the inductor, and the output capacitors must be as close as possible to each other to reduce IR drop across the copper. All bypass and output capacitors must be con- nected as close as possible to the respective pin on the IC. • • • • • • • • • |
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