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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MF1S5009DA4 датащи(PDF) 4 Page - NXP Semiconductors |
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MF1S5009DA4 датащи(HTML) 4 Page - NXP Semiconductors |
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4 / 32 page  MF1S5009 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet PUBLIC Rev. 3 — 27 July 2010 189131 4 of 32 NXP Semiconductors MF1S5009 Mainstream contactless smart card IC 6. Pinning information 6.1 Smart card contactless module 7. Mechanical specification Fig 3. Contact assignments for SOT500-2 (MOA4) Table 2. Bonding pad assignments to smart card contactless module Contactless interface module MF1S5009DA4 Antenna contacts Symbol Description LA LA Antenna coil connection LA LB LB Antenna coil connection LB 001aam200 top view LA LB Table 3. Specifications Wafer diameter 200 mm typical (8 inches) maximum diameter after foil expansion 210 mm thickness 120 μm ± 15 μm flatness not applicable Potential Good Dies per Wafer (PGDW) 18482 Wafer backside material Si treatment ground and stress relieve roughness Ra max = 0.2 μm Rt max = 2 μm Chip dimensions step size x = 1231 μm y = 1280 μm |
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