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MF1S5009DA4 датащи(PDF) 26 Page - NXP Semiconductors

номер детали MF1S5009DA4
подробное описание детали  Mainstream contactless smart card IC for fast and easy solution development
PDF  32 Pages
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производитель  NXP [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo NXP - NXP Semiconductors

MF1S5009DA4 датащи(HTML) 26 Page - NXP Semiconductors

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MF1S5009
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
PUBLIC
Rev. 3 — 27 July 2010
189131
26 of 32
NXP Semiconductors
MF1S5009
Mainstream contactless smart card IC
14. Package outline
Fig 20. Package outline SOT500-2
UNIT
D
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
35.05
34.95
For unspecified dimensions see PLLMC-drawing given in the subpackage code.
DIMENSIONS (mm are the original dimensions)
SOT500-2
03-09-17
06-05-22
- - -
- - -
- - -
PLLMC: plastic leadless module carrier package; 35 mm wide tape
SOT500-2
A(1)
max.
0.33
0
10
20 mm
scale
A
detail X
X
Note
1. Total package thickness, exclusive punching burr.
D



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