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MMDF2P02ER2 датащи(PDF) 1 Page - ON Semiconductor

номер детали MMDF2P02ER2
подробное описание детали  Power MOSFET 2 Amps, 25 Volts P?묬hannel SO??, Dual
PDF  7 Pages
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производитель  ONSEMI [ON Semiconductor]
домашняя страница  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MMDF2P02ER2 датащи(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2006
April, 2006 − Rev. 8
1
Publication Order Number:
MMDF2P02E/D
MMDF2P02E
Power MOSFET
2 Amps, 25 Volts
P−Channel SO−8, Dual
These miniature surface mount MOSFETs feature ultra low RDS(on)
and true logic level performance. They are capable of withstanding
high energy in the avalanche and commutation modes and the
drain−to−source diode has a low reverse recovery time. MiniMOS
t
devices are designed for use in low voltage, high speed switching
applications where power efficiency is important. Typical applications
are dc−dc converters, and power management in portable and battery
powered products such as computers, printers, cellular and cordless
phones. They can also be used for low voltage motor controls in mass
storage products such as disk drives and tape drives. The avalanche
energy is specified to eliminate the guesswork in designs where
inductive loads are switched and offer additional safety margin against
unexpected voltage transients.
Features
• Ultra Low RDS(on) Provides Higher Efficiency and Extends Battery Life
• Logic Level Gate Drive − Can Be Driven by Logic ICs
• Miniature SO−8 Surface Mount Package − Saves Board Space
• Diode Is Characterized for Use In Bridge Circuits
• Diode Exhibits High Speed, with Soft Recovery
• IDSS Specified at Elevated Temperatures
• Avalanche Energy Specified
• Mounting Information for SO−8 Package Provided
• Pb−Free Package is Available
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) (Note 1)
Rating
Symbol
Value
Unit
Drain−to−Source Voltage
VDSS
25
Vdc
Gate−to−Source Voltage − Continuous
VGS
± 20
Vdc
Drain Current − Continuous @ TA = 25°C
Drain Current − Continuous @ TA = 100°C
Drain Current − Single Pulse (tp ≤ 10 ms)
ID
ID
IDM
2.5
1.7
13
Adc
Apk
Total Power Dissipation @ TA = 25°C (Note
2)
Derate above 25
°C
PD
2.0
16
W
mW/
°C
Operating and Storage Temperature Range
TJ, Tstg
−55 to 150
°C
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C
(VDD = 20 Vdc, VGS = 10 Vdc, Peak
IL = 7.0 Apk, L = 10 mH, RG = 25 W)
EAS
245
mJ
Thermal Resistance, Junction−to−Ambient
(Note 2)
RqJA
62.5
°C/W
Maximum Lead Temperature for Soldering
Purposes, 0.0625
″ from case for 10 sec.
TL
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Negative sign for P−Channel device omitted for clarity.
2. Mounted on 2
″ square FR4 board (1″ sq. 2 oz. Cu 0.06″ thick single sided) with
one die operating, 10 sec. max.
Source−1
1
2
3
4
8
7
6
5
Top View
Gate−1
Source−2
Gate−2
Drain−1
Drain−1
Drain−2
Drain−2
D
S
G
2 AMPERES, 25 VOLTS
RDS(on) = 250 mW
Device
Package
Shipping†
ORDERING INFORMATION
MMDF2P02ER2
SO−8
2500 Tape & Reel
SO−8, Dual
CASE 751
STYLE 11
P−Channel
MARKING
DIAGRAM
PIN ASSIGNMENT
MMDF2P02ER2G
SO−8
(Pb−Free)
2500 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1
8
F2PO2
AYWW
G
G
1
8
F2P02
= Specific Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
http://onsemi.com


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