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MMDF2N02ER2 датащи(PDF) 1 Page - ON Semiconductor |
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MMDF2N02ER2 датащи(HTML) 1 Page - ON Semiconductor |
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1 / 7 page ![]() © Semiconductor Components Industries, LLC, 2006 February, 2006 − Rev. 7 1 Publication Order Number: MMDFN02E/D MMDF2N02E Power MOSFET 2 Amps, 25 Volts N−Channel SO−8, Dual These miniature surface mount MOSFETs feature ultra low RDS(on) and true logic level performance. They are capable of withstanding high energy in the avalanche and commutation modes and the drain−to−source diode has a low reverse recovery time. MiniMOS t devices are designed for use in low voltage, high speed switching applications where power efficiency is important. Typical applications are dc−dc converters, and power management in portable and battery powered products such as computers, printers, cellular and cordless phones. They can also be used for low voltage motor controls in mass storage products such as disk drives and tape drives. The avalanche energy is specified to eliminate the guesswork in designs where inductive loads are switched and offer additional safety margin against unexpected voltage transients. Features • Ultra Low RDS(on) Provides Higher Efficiency and Extends Battery Life • Logic Level Gate Drive − Can Be Driven by Logic ICs • Miniature SO−8 Surface Mount Package − Saves Board Space • Diode Is Characterized for Use In Bridge Circuits • IDSS Specified at Elevated Temperatures • Avalanche Energy Specified • Mounting Information for SO−8 Package Provided • Pb−Free Package is Available MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Symbol Value Unit Drain−to−Source Voltage VDSS 25 Vdc Gate−to−Source Voltage − Continuous VGS ± 20 Vdc Drain Current − Continuous @ TA = 25°C Drain Current − Continuous @ TA = 100°C Drain Current − Single Pulse (tp ≤ 10 ms) ID ID IDM 3.6 2.5 18 Adc Apk Total Power Dissipation @ TA = 25°C (Note 1) PD 2.0 W Operating and Storage Temperature Range TJ, Tstg −55 to 150 °C Single Pulse Drain−to−Source Avalanche Energy − Starting TJ = 25°C (VDD = 20 Vdc, VGS = 10 Vdc, Peak IL = 9.0 Apk, L = 6.0 mH, RG = 25 W) EAS 245 mJ Thermal Resistance, Junction−to−Ambient (Note 1) RqJA 62.5 °C/W Maximum Lead Temperature for Soldering Purposes, 0.0625 ″ from case for 10 seconds TL 260 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Mounted on 2 ″ square FR4 board (1″ sq. 2 oz. Cu 0.06″ thick single sided) with one die operating, 10 sec. max. Source−1 1 2 3 4 8 7 6 5 Gate−1 Source−2 Gate−2 Drain−1 Drain−1 Drain−2 Drain−2 2 AMPERES, 25 VOLTS RDS(on) = 100 mW Device Package Shipping† ORDERING INFORMATION MMDF2N02ER2 SO−8 2500 Tape & Reel N−Channel PIN ASSIGNMENT D S G http://onsemi.com MMDF2N02ER2G SO−8 (Pb−Free) 2500 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Discrete (Pb−Free) SO−8 CASE 751 STYLE 11 MARKING DIAGRAM F2N02 = Device Code A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) F2N02 AYWW G G 1 8 1 8 |
Аналогичный номер детали - MMDF2N02ER2 |
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Аналогичное описание - MMDF2N02ER2 |
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