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MMDF2N02ER2 датащи(PDF) 1 Page - ON Semiconductor

номер детали MMDF2N02ER2
подробное описание детали  Power MOSFET 2 Amps, 25 Volts N?묬hannel SO??, Dual
PDF  7 Pages
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производитель  ONSEMI [ON Semiconductor]
домашняя страница  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MMDF2N02ER2 датащи(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 7
1
Publication Order Number:
MMDFN02E/D
MMDF2N02E
Power MOSFET
2 Amps, 25 Volts
N−Channel SO−8, Dual
These miniature surface mount MOSFETs feature ultra low RDS(on)
and true logic level performance. They are capable of withstanding
high energy in the avalanche and commutation modes and the
drain−to−source diode has a low reverse recovery time. MiniMOS
t
devices are designed for use in low voltage, high speed switching
applications where power efficiency is important. Typical applications
are dc−dc converters, and power management in portable and battery
powered products such as computers, printers, cellular and cordless
phones. They can also be used for low voltage motor controls in mass
storage products such as disk drives and tape drives. The avalanche
energy is specified to eliminate the guesswork in designs where
inductive loads are switched and offer additional safety margin against
unexpected voltage transients.
Features
• Ultra Low RDS(on) Provides Higher Efficiency and Extends Battery Life
• Logic Level Gate Drive − Can Be Driven by Logic ICs
• Miniature SO−8 Surface Mount Package − Saves Board Space
• Diode Is Characterized for Use In Bridge Circuits
• IDSS Specified at Elevated Temperatures
• Avalanche Energy Specified
• Mounting Information for SO−8 Package Provided
• Pb−Free Package is Available
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Drain−to−Source Voltage
VDSS
25
Vdc
Gate−to−Source Voltage − Continuous
VGS
± 20
Vdc
Drain Current − Continuous @ TA = 25°C
Drain Current − Continuous @ TA = 100°C
Drain Current − Single Pulse (tp ≤ 10 ms)
ID
ID
IDM
3.6
2.5
18
Adc
Apk
Total Power Dissipation @ TA = 25°C (Note 1)
PD
2.0
W
Operating and Storage Temperature Range
TJ, Tstg
−55 to 150
°C
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C (VDD = 20 Vdc,
VGS = 10 Vdc, Peak IL = 9.0 Apk,
L = 6.0 mH, RG = 25 W)
EAS
245
mJ
Thermal Resistance, Junction−to−Ambient
(Note 1)
RqJA
62.5
°C/W
Maximum Lead Temperature for Soldering
Purposes, 0.0625
″ from case for 10 seconds
TL
260
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Mounted on 2
″ square FR4 board (1″ sq. 2 oz. Cu 0.06″ thick single sided) with
one die operating, 10 sec. max.
Source−1
1
2
3
4
8
7
6
5
Gate−1
Source−2
Gate−2
Drain−1
Drain−1
Drain−2
Drain−2
2 AMPERES, 25 VOLTS
RDS(on) = 100 mW
Device
Package
Shipping†
ORDERING INFORMATION
MMDF2N02ER2
SO−8
2500 Tape & Reel
N−Channel
PIN ASSIGNMENT
D
S
G
http://onsemi.com
MMDF2N02ER2G
SO−8
(Pb−Free)
2500 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Discrete
(Pb−Free)
SO−8
CASE 751
STYLE 11
MARKING
DIAGRAM
F2N02
= Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
F2N02
AYWW
G
G
1
8
1
8


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