ADP4100

http://onsemi.com

4

ABSOLUTE MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Input Voltage Range (Note 1)

−0.3 to 6

V

FBRTN

−0.3 to + 0.3 V

V

PWM2 to PWM6, Rampadj

V

SW1 to SW6

−5 to +25 V

V

SW1 to SW6 (<200 ns|)

−10 to +25 V

V

All other Inputs and Outputs

V

Storage Temperature Range

TSTG

−65 to 150

°C

Operating Ambient Temperature Range

0 to 85

°C

ESD Capability, Human Body Model (Note 2)

2

kV

ESD Capability, Machine Model (Note 2)

100

V

Moisture Sensitivity Level

MSL

3

−

Lead Temperature Soldering

Reflow (SMD Styles Only), Pb−Free Versions (Note 3)

260

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. Refer to Electrical Characteristics and Application Information for Safe Operating Area.

2. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)

ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)

Latchup Current Maximum Rating: ≤150 mA per JEDEC standard: JESD78

3. For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting

Techniques Reference Manual, SOLDERRM/D.

THERMAL CHARACTERISTICS

Characteristic

Symbol

Value

Unit

Thermal Characteristics, LFCSP, 7mm * 7mm (Note 1)

Thermal Resistance, Junction−to−Air (Note 4)

Thermal Resistance, Junction−to−Lead 2 (Note 4)

24

10

°C/W

Characteristic

Symbol

Min

Max

Unit

Output Voltage (Note 5)

0.375

1.6

V

Ambient Temperature

0

85

°C