CS35L01/03

DS909A2

31

8.2

Recommend PCB Footprint and Routing Configuration

To ensure high-yield manufacturability, the PCB footprint for the CS35L01/03 should be constructed with

strict adherence to the specifications given in IPC-610. Departure from this specification significantly in-

creases the probability of solder bridging and other manufacturing defects.

Routing of the traces into and out of the CS35L01/03 device should also be given consideration to avoid

manufacturing issues.

8.3

Package Thermal Performance

Class-D amplifiers, though highly efficient, will produce some amount of heat through the process of ampli-

fying the audio signal. As is well understood, this amount of heat is very small compared to traditional Class

AB amplifiers. Even so, as power levels increase and package sizes decrease, careful consideration must

be given to ensure thermal energy is removed from the device as efficiently as possible so that its operating

temperature is kept under its Over-Temperature Error Threshold.

The thermal impedance,

device to the environment surrounding the device. This specification is directly related to the ability of the

PCB to which the CS35L01/03 is attached to transfer the heat from the device. The thermal impedance from

the junction of the device to the ambient surrounding the device and the thermal impedance from the device

into the PCB is shown in Table 2.

.

Table 2.

Note:

20. Test Printed Circuit Board Assembly (PCBA) constructed in accordance with JEDEC standard

JESD51-9. Two signal, two plane (2s2p) PCB utilized.

21. Test conducted with still air in accordance with JEDEC standards JESD51, JESD51-2A, and

JESD51-8.

Parameter

(Note 20), (Note 21)

Symbol

Min

Typical

Max

Units

Junction to Ambient Thermal Impedance

-92-

°C/Watt

Junction to Printed Circuit Board Thermal Impedance

-67-

°C/Watt